Semiconductor device and method

A method comprising:

• encapsulating a plurality of first integrated circuit devices with a first molding compound;
• forming a first photosensitive adhesive layer over the first integrated circuit devices;
• patterning a first opening in the first photosensitive adhesive layer;
• plating a first conductive layer in the first opening;
• plating a first reflowable layer on the first conductive layer, a combined thickness of the first conductive layer and the first reflowable layer being less than a first thickness of the first photosensitive adhesive layer, the first conductive layer and the first reflowable layer electrically connected to the first integrated circuit devices;
• pressing a second integrated circuit device to the first photosensitive adhesive layer to physically connect the first and second integrated circuit devices;
• and
• reflowing the first reflowable layer to form a conductive connector electrically connecting the first and second integrated circuit devices.

A method comprising:

• forming a first photosensitive adhesive layer on an integrated circuit device;
• patterning a first opening in the first photosensitive adhesive layer, the first opening exposing a first connector of the integrated circuit device;
• plating a first conductive layer in the first opening on the first connector;
• plating a first reflowable layer in the first opening on the first conductive layer, a first combined thickness of the first conductive layer and the first reflowable layer being less than a first thickness of the first photosensitive adhesive layer;
• forming a second photosensitive adhesive layer on an interposer;
• patterning a second opening in the second photosensitive adhesive layer, the second opening exposing a second connector of the interposer;
• plating a second conductive layer in the second opening on the second connector;
• plating a second reflowable layer in the second opening on the second conductive layer, a second combined thickness of the second conductive layer and the second reflowable layer being different from a second thickness of the second photosensitive adhesive layer;
• pressing the first and second photosensitive adhesive layers together to physically couple the integrated circuit device and the interposer;
• and
• reflowing the first and second reflowable layers to form a conductive connector electrically coupling the integrated circuit device and the interposer.