Multiple bond via arrays of different wire heights on a same substrate
AssigneeInvensas Corporation
InventorsCyprian Emeka Uzoh, Rajesh Katkar
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Abstract
An apparatus relating generally to a substrate is disclosed. In such an apparatus, a first bond via array has first wires extending from a surface of the substrate. A second bond via array has second wires extending from the surface of the substrate. The first bond via array is disposed at least partially within the second bond via array. The first wires of the first bond via array are of a first height. The second wires of the second bond via array are of a second height greater than the first height for coupling of at least one die to the first bond via array at least partially disposed within the second bond via array.
Claims12
An apparatus, comprising:
- a substrate;
- a first bond via array of first wire bond wires (“first wires”) extending from a surface of the substrate;
- a second bond via array of second wire bond wires (“second wires”) extending from the surface of the substrate;
- wherein the first bond via array and the second bond via array are external to the substrate;
- wherein the first bond via array is disposed at least partially within the second bond via array;
- wherein the first wires of the first bond via array are of a first height;
- and
- wherein the second wires of the second bond via array are of a second height greater than the first height for coupling of at least one die to the first bond via array at least partially disposed within the second bond via array.
Dependencies are inferred from the claim text.