H10W 72/324
Die-attach connectors having multiple side-by-side cores
Official title: {Die-attach connectors having multiple side-by-side cores}
H10W72/324 (Die-attach connectors having multiple side-by-side cores) appears on 148 US grants and 198 published applications in this corpus.
Search patents in H10W- Granted patents
- 148
- Published applications
- 198
- Assignees
- 96
- Inventors
- 432
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 1 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 1 | 1 |
| 2007 | 1 | 0 |
| 2008 | 1 | 0 |
| 2009 | 0 | 2 |
| 2010 | 2 | 2 |
| 2011 | 0 | 2 |
| 2012 | 0 | 3 |
| 2013 | 1 | 4 |
| 2014 | 5 | 13 |
| 2015 | 10 | 12 |
| 2016 | 9 | 12 |
| 2017 | 12 | 16 |
| 2018 | 7 | 5 |
| 2019 | 13 | 18 |
| 2020 | 11 | 22 |
| 2021 | 16 | 20 |
| 2022 | 11 | 19 |
| 2023 | 17 | 11 |
| 2024 | 17 | 13 |
| 2025 | 5 | 11 |
| 2026 | 6 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package and method of manufacturing the same1 Sep 2026US 12,727,175 B2Samsung Electronics Co., Ltd.
- EMI cage for microstrip routing via dual layer underfill concept18 Aug 2026US 12,713,928 B2Intel Corporation
- Integration and bonding of micro-devices into system substrate11 Aug 2026US 12,707,781 B2VueReal Inc.
- Selective transfer of micro devices14 Jul 2026US 12,684,691 B2VueReal Inc.
- Hybrid underfill structures for multi-die packages and methods of forming the same23 Jun 2026US 12,667,020 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Hybrid Underfill Structures for Multi-Die Packages and Methods of Forming the Same1 Oct 2026US 2026/0305473 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Heat dissipation structure in advanced chip package2 Jul 2026US 2026/0190990 A1Intel Corporation
- Bonded structure2 Jul 2026US 2026/0190992 A1Denso Corporation
- A method for bonding a first and second planar substrate18 Jun 2026US 2026/0173943 A1Technische Universiteit Eindhoven
- Semiconductor device11 Jun 2026US 2026/0165179 A1Fuji Electric Co., Ltd.
Most cited
By later US patents
- Laser assisted transfer welding process144US 9,161,448 B2Semprius, Inc. · 2015
- Electrically bonded arrays of transfer printed active components67US 9,049,797 B2Semprius, Inc. · 2015
- Interconnect structures with polymer core59US 8,987,918 B2Intel Corporation · 2015
- Method and device for mounting electronic component on circuit board37US 6,981,317 B1Matsushita Electric Industrial Co., Ltd. · 2006
- Semiconductor package with alternating thermal interface and adhesive materials and method for manufacturing the same32US 8,981,550 B2Amkor Technology, Inc. · 2015