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US 6,981,317 B1Granted
Method and device for mounting electronic component on circuit board
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorKazuto Nishida
Life of this patent
Estimating the term…
Abstract
When mounting an IC chip on a circuit board, bumps are formed on electrodes of the IC chip, and the bumps and the electrodes of the circuit board are aligned in position with each other with interposition of an insulative thermosetting resin having no conductive particle between the electrodes of the circuit board and the bumps. The IC chip is pressed against the circuit board with a pressure force of not smaller than 20 gf per bump by a heated head so as to perform warp correction of the IC chip and the board, while the resin interposed between the IC chip and the circuit board is hardened to bond the IC chip and the circuit board together.
Claims28
A method of mounting an electronic component, said method comprising:
- aligning in position bumps formed by wire-bonding on electrodes of said electronic component with electrodes of a circuit board, with interposition between said electronic component and said circuit board of insulative solid thermosetting resin;
- softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin interposed between said electronic component and said circuit board, while achieving mutual pressing between said electronic component and said circuit board at a pressure of force of at least 20 gf per bump during leveling of said bumps and correcting of any warping of said circuit board thereby bonding said electronic component and said circuit board together to achieve electrical connection between said mutual electrodes thereof;
- and
- said hardening, said leveling and said correcting being achieved at approximately the same time,
- wherein said thermosetting resin includes conductive particles.
2 more elements
A method of mounting an electronic component, said method comprising:
- aligning in position bumps formed by wire-bonding on electrodes of said electronic component with electrodes of a circuit board, with interposition between said electronic component and said circuit board of insulative solid thermosetting resin;
- softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin interposed between said electronic component and said circuit board, while achieving mutual pressing between said electronic component and said circuit board at a pressure of force of at least 20 gf per bump during leveling of said bumps and correcting of any warping of said circuit board, thereby bonding said electronic component and said circuit board together to achieve electrical connection between said mutual electrodes thereof;
- and
- said hardening, said leveling and said correcting being achieved at approximately the same time,
- wherein, prior to said aligning, said thermosetting resin, in the form of a solid thermosetting resin sheet having a shape dimension smaller than an outside dimension of connection between said electrodes of said electronic component, is applied to said circuit board, and said hardening with heat comprises applying said heat to said sheet, and
- wherein prior to said aligning, conductive adhesive is applied to said bumps.
3 more elements
A method of mounting an electronic component, said method comprising:
- aligning in position bumps formed by wire-bonding on electrodes of said electronic component with electrodes of a circuit board, with interposition between said electronic component and said circuit board of insulative solid thermosetting resin;
- softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin interposed between said electronic component and said circuit board, while achieving mutual pressing between said electronic component and said circuit board at a pressure of force of at least 20 gf per bump during leveling of said bumps and correcting of any warping of said circuit board, thereby bonding said electronic component and said circuit board together to achieve electrical connection between said mutual electrodes thereof;
- and
- said hardening, said leveling and said correcting being achieved at approximately the same time,
- wherein, prior to said aligning, said thermosetting resin, in the form of a solid thermosetting resin sheet having holes formed at positions corresponding either to said bumps or to said electrodes of said circuit board and extending in a direction of extension of said bumps, with particles being embedded and electrically continuous in said holes, said particles comprising resin balls having surfaces plated with gold, nickel particles, conductive particles made of silver, silver-palladium or gold, conductive paste, or gold balls, is applied to said electrodes of said circuit board by positional alignment, and said bonding is executed by said hardening said sheet by application of heat thereto while conducting said pressing by forcing said electronic component toward said circuit board.
2 more elements
A method of mounting an electronic component, said method comprising:
- aligning in position electrodes of said electronic component with electrodes of a circuit board, with interposition between said electronic component and said circuit board of insulative solid thermosetting resin;
- softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin interposed between said electronic component and said circuit board, while achieving mutual pressing between said electronic component and said circuit board during correcting of any warping of said circuit board, thereby bonding said electronic component and said circuit board together to achieve electrical connection between said mutual electrodes thereof;
- wherein, prior to said aligning, said thermosetting resin, in the form of a solid thermosetting resin sheet having holes formed at positions corresponding to said electrodes of said circuit board and extending in a direction of extension of said electrodes, with particles being embedded and electrically continuous in said holes, said particles comprising resin balls having surfaces plated with gold, nickel particles, conductive particles made of silver, silver-palladium or gold, conductive paste, or gold balls, is applied to said electrodes of said circuit board by positional alignment, and said bonding is executed by said hardening said sheet by application of heat thereto while conducting said pressing by forcing said electronic component toward said circuit board;
- and
- wherein each of said particles has a size greater than a thickness of a passivation film to be coated on at least said electrodes of said electronic component and smaller than a thickness of one of said electrodes of said circuit board, and said bonding further is executed by applying ultrasonic vibrations to said electronic component.
2 more elements
A method of mounting an electronic component, said method comprising:
- aligning in position bumps formed by wire-bonding on electrodes of said electronic component with electrodes of a circuit board, with interposition between said electronic component and said circuit board of insulative solid thermosetting resin;
- softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin interposed between said electronic component and said circuit board, while achieving mutual pressing between said electronic component and said circuit board at a pressure of force of at least 20 gf per bump during leveling of said bumps and correcting of any warping of said circuit board, thereby bonding said electronic component and said circuit board together to achieve electrical connection between said mutual electrodes thereof;
- said hardening, said leveling and said correcting being achieved at approximately the same time;
- and
- applying conductive paste to said bumps, hardening said conductive paste to function as part of said bumps, and, during said bonding, forcing the thus hardened conductive paste through said thermosetting resin and forming electrical connections between said hardened conductive paste and said electrodes of said circuit board.
2 more elements
A method of mounting an electronic component, said method comprising:
- aligning in position bumps formed by wire-bonding on electrodes of said electronic component with electrodes of a circuit board, with interposition between said electronic component and said circuit board of insulative solid thermosetting resin;
- softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin interposed between said electronic component and said circuit board, while achieving mutual pressing between said electronic component and said circuit board at a pressure of force of at least 20 gf per bump during leveling of said bumps and correcting of any warping of said circuit board, thereby bonding said electronic component and said circuit board together to achieve electrical connection between said mutual electrodes thereof;
- and
- said hardening, said leveling and said correcting being achieved at approximately the same time,
- wherein said thermosetting resin comprises a thermosetting resin sheet having an anisotropic conductive film, and
- wherein said conductive film includes conductive nickel particles plated with gold.
3 more elements
A method of mounting an electronic component, said method comprising:
- aligning in position bumps formed by wire-bonding on electrodes of said electronic component with electrodes of a circuit board, with interposition between said electronic component and said circuit board of insulative solid thermosetting resin;
- softening to flow up to an edge of said electronic component, and then hardening, with heat, said thermosetting resin interposed between said electronic component and said circuit board, while achieving mutual pressing between said electronic component and said circuit board at a pressure of force of at least 20 gf per bump during leveling of said bumps and correcting of any warping of said circuit board, thereby bonding said electronic component and said circuit board together to achieve electrical connection between said mutual electrodes thereof;
- and
- said hardening, said leveling and said correcting being achieved at approximately the same time,
- wherein said solid thermosetting resin includes an inorganic filler.
2 more elements
Dependencies are inferred from the claim text.