Semiconductor package with alternating thermal interface and adhesive materials and method for manufacturing the same
AssigneeAmkor Technology, Inc.
InventorsJoon Young Park, Jin Suk Jeong, Kyeong Sool Seong, Seo Won Lee
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Abstract
A semiconductor package improves reliability of heat emitting performance by maintaining a heat emitting lid stacked on a top surface of a semiconductor chip at a tightly adhered state. A highly adhesive interface material and a thermal interface material are applied to the top surface of the semiconductor chip. The highly adhesive interface material insures that the heat emitting lid is bonded to the top surface while the thermal interface material insures excellent heat transfer between the top surface and the heat emitting lid.
Claims22
A semiconductor package comprising:
- a semiconductor chip comprising an inactive surface;
- an adhesive interface material adhered to an adhesive region of the inactive surface;
- a thermal interface material adhered to a heat transfer region of the inactive surface;
- and
- a heat emitting lid adhered to the inactive surface by the adhesive interface material and the thermal interface material, wherein the adhesive interface material has a greater bonding strength than the thermal interface material.
A semiconductor package comprising:
- a substrate;
- a semiconductor chip;
- bumps conductively attaching the semiconductor chip to the substrate;
- a heat emitting lid attached to an inactive surface of the semiconductor chip and edge regions of a top surface of the substrate, wherein the heat emitting lid is adhered and fixed to a highly adhesive interface material while also being adhered to a thermal interface material having a high heat transmission efficiency throughout the inactive surface of the semiconductor chip, the highly adhesive interface material being applied to an adhesive region of the inactive surface of the semiconductor chip and the thermal interface material being applied at a heat transfer region of the inactive surface of the semiconductor chip different from the adhesive region.
A semiconductor package comprising:
- a substrate;
- a semiconductor chip comprising an active surface and an inactive surface;
- bumps conductively attaching the active surface of the semiconductor chip to the substrate;
- a heat emitting lid attached to the inactive surface of the semiconductor chip using both an epoxy-based adhesive material and an epoxy resin-based thermal interface material.
A method for a semiconductor package, the method comprising:
- providing a semiconductor package, the package comprising:
- a semiconductor chip comprising an inactive surface;
- an adhesive interface material adhered to an adhesive region of the inactive surface;
- a thermal interface material adhered to a heat transfer region of the inactive surface;
- and
- a heat emitting lid adhered to the inactive surface by the adhesive interface material and the thermal interface material, wherein the adhesive interface material has a greater bonding strength than the thermal interface material.
Dependencies are inferred from the claim text.