Bonded structure
AssigneesDenso Corporation, Toyota Jidosha Kabushiki Kaisha, MIRISE Technologies Corporation
InventorsYoshihiko KANDA, Tomohito IWASHIGE
Life of this patent
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Abstract
A bonded structure includes a first member, a second member, and a sinter-bonding layer. The second member includes a brush structure formed of multiple metal wires, each of which has a columnar shape. The sinter-bonding layer bonds the first member to the brush structure and is disposed apart from a portion of the second member that is different from the brush structure. The multiple metal wires extend in an extension direction. Porosity is defined as a proportion of an area occupied by gaps between the multiple metal wires in the brush structure in a plane perpendicular to the extension direction. The porosity of the brush structure falls within a range from 15% to 85%.
Claims5
A bonded structure comprising:
- a first member;
- a second member having a brush structure formed of multiple metal wires, each of the multiple metal wires having a columnar shape;
- and
- a sinter-bonding layer bonding the first member to the brush structure, and disposed apart from a portion of the second member that is different from the brush structure, wherein
- the multiple metal wires extend in an extension direction,
- porosity is defined as a proportion of an area occupied by gaps between the multiple metal wires in the brush structure in a plane perpendicular to the extension direction, and
- the porosity of the brush structure falls within a range from 15% to 85%.
Dependencies are inferred from the claim text.