A method for bonding a first and second planar substrate
AssigneeTechnische Universiteit Eindhoven
InventorsAbdi SALIM, Tjibbe DE VRIES, Yuqing JIAO
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Abstract
The present invention relates to a method for bonding a first planar substrate which has a plurality of pillars extending from the substrate to a second planar substrate. The present invention also relates to a bonded planar device. An object of the present invention is to provide a method for bonding planar substrates resulting in accurate substrate-scale post-bonding thickness uniformity and alignment accuracy.
Claims16
A method for bonding a first planar substrate which has a plurality of pillars extending from the substrate to a second planar substrate, the method comprising:
- applying a bonding material to the second planar substrate,
- pressing together the second planar substrate and the first planar substrate so that the plurality of pillars puncture the bonding material,
- applying a source of heat to ramp up the temperature during bonding whereby the bonding material liquifies and the plurality of pillars of the first planar substrate reach the second planar substrate;
- and
- removing the source of heat so that the bonding material is allowed to cool, wherein the bonding material is a polymer.
A bonded planar device, the bonded planar device comprising:
- a first planar substrate, the first planar substrate comprising a plurality of pillars, wherein the plurality of pillars extend from the substrate;
- a second planar substrate;
- and bonding material, wherein:
- the bonding material fastens the first planar substrate to the second planar substrate;
- and the bonding material surrounds each of the plurality of pillars by contacting the one or more sides of each pillar of the plurality of pillars, wherein the bonding material is a polymer.
Dependencies are inferred from the claim text.