H10W 72/07654
Changes in dispositions
Official title: {changes in dispositions}
H10W72/07654 (Changes in dispositions) appears on 61 US grants and 80 published applications in this corpus.
Search patents in H10W- Granted patents
- 61
- Published applications
- 80
- Assignees
- 29
- Inventors
- 146
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2011 | 0 | 1 |
| 2012 | 0 | 3 |
| 2013 | 1 | 0 |
| 2014 | 2 | 3 |
| 2015 | 2 | 8 |
| 2016 | 3 | 6 |
| 2017 | 10 | 7 |
| 2018 | 4 | 5 |
| 2019 | 5 | 5 |
| 2020 | 6 | 8 |
| 2021 | 7 | 8 |
| 2022 | 2 | 8 |
| 2023 | 5 | 3 |
| 2024 | 5 | 7 |
| 2025 | 5 | 6 |
| 2026 | 4 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Isolated metal clips with structural bridge14 Jul 2026US 12,685,193 B2Analog Devices, Inc.
- Clip interconnect with micro contact heads2 Jun 2026US 12,648,455 B2Semiconductor Components Industries, LLC
- Semiconductor device28 Apr 2026US 12,616,076 B2Fuji Electric Co., Ltd.
- Electrical connection element and correspond method and apparatus with outgassing grooves that remove trapped gasses14 Apr 2026US 12,604,774 B2Infineon Technologies AG
- Semiconductor device4 Nov 2025US 12,463,120 B2Rohm Co., Ltd.
- Isolated metal clips with structural bridge8 Oct 2026US 2026/0314452 A1Analog Devices, Inc.
- Semiconductor device12 Feb 2026US 2026/0047511 A1Rohm Co., Ltd.
- Semiconductor device and electronic device25 Dec 2025US 2025/0391804 A1Rohm Co., Ltd.
- Semiconductor device27 Nov 2025US 2025/0364438 A1Rohm Co., Ltd.
- Connecting strip for discrete and power electronic devices16 Oct 2025US 2025/0323205 A1STMicroelectronics S,r.l.
Most cited
By later US patents
- Method for fabricating stack die package23US 9,589,929 B2Vishay-Siliconix · 2017
- Packaging solutions for devices and systems comprising lateral GaN power transistors20US 9,589,868 B2GaN Systems Inc. · 2017
- Packaging solutions for devices and systems comprising lateral GaN power transistors11US 9,589,869 B2GaN Systems Inc. · 2017
- Stacked die power converter8US 9,842,797 B2Texas Instruments Incorporated · 2017
- Semiconductor package7US 9,601,453 B2MagnaChip Semiconductor, Ltd. · 2017