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US 12,463,120 B2Granted
Semiconductor device
AssigneeRohm Co., Ltd.
InventorsKenji Hayashi, Takumi Kanda, Noriaki Kawamoto
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a first die pad having a main surface, a second die pad having a second main surface, a first switching element connected to the first main surface, a second switching element connected to the second main surface, a first connecting member connecting the first main surface electrode of the first switching element to the second die pad, an encapsulation resin encapsulating the first switching element, the second switching element, the first die pad, the second die pad, and the first connecting member, and leads projecting out of one of the resin side surfaces of the encapsulation resin.
Claims26
A semiconductor device comprising:
- a first die pad including a first main surface;
- a second die pad spaced apart from the first die pad in a first direction that extends parallel to the first main surface, wherein the second die pad includes a second main surface facing the same direction as the first main surface;
- a first switching element, mounted on the first main surface, and including a first element main surface facing the same direction as the first main surface, a first element back surface facing in the opposite direction of the first element main surface, a first main surface electrode and a first control electrode that are arranged on the first element main surface, and a first back surface electrode arranged on the first element back surface, wherein the first back surface electrode is connected to the first main surface;
- a second switching element, mounted on the second main surface, and including a second element main surface facing the same direction as the second main surface, a second element back surface facing in the opposite direction of the second element main surface, a second main surface electrode and a second control electrode that are arranged on the second element main surface, and a second back surface electrode arranged on the second element back surface, wherein the second back surface electrode is connected to the second main surface;
- a first connecting member connecting the first main surface electrode of the first switching element to the second die pad;
- an encapsulation resin including resin side surfaces facing a direction extending parallel to the first main surface and the second main surface, wherein the encapsulation resin encapsulates the first switching element, the second switching element, the first die pad, the second die pad, and the first connecting member;
- and
- leads arranged in the first direction, wherein the leads project out of one of the resin side surfaces of the encapsulation resin in a second direction intersecting the first direction, and the leads extend in the second direction.
5 more elements
A semiconductor device comprising:
- a first die pad including a first main surface;
- a second die pad spaced apart from the first die pad in a first direction that extends parallel to the first main surface, wherein the second die pad includes a second main surface facing the same direction as the first main surface;
- a first switching element, mounted on the first main surface, and including a first element main surface facing the same direction as the first main surface, a first element back surface facing in the opposite direction of the first element main surface, a first main surface electrode and a first control electrode that are arranged on the first element main surface, and a first back surface electrode arranged on the first element back surface, wherein the first back surface electrode is connected to the first main surface;
- a second switching element, mounted on the second main surface, and including a second element main surface facing the same direction as the second main surface, a second element back surface facing in the opposite direction of the second element main surface, a second main surface electrode and a second control electrode that are arranged on the second element main surface, and a second back surface electrode arranged on the second element back surface, wherein the second back surface electrode is connected to the second main surface;
- a first connecting member connected to the first main surface electrode of the first switching element;
- an encapsulation resin including resin side surfaces facing a direction extending parallel to the first main surface and the second main surface, wherein the encapsulation resin encapsulates the first switching element, the second switching element, the first die pad, the second die pad, and the first connecting member;
- a first lead group including leads projecting out of, among the resin side surfaces, a first resin side surface that faces a second direction intersecting the first direction;
- and
- a second lead group including leads projecting out of a second resin side surface facing in the opposite direction of the first resin side surface,
- wherein the first main surface electrode of the first switching element is electrically connected to the second die pad by the first connecting member.
7 more elements
Dependencies are inferred from the claim text.