H10W 72/07233
Ultrasonic bonding
Official title: {Ultrasonic bonding, e.g. thermosonic bonding}
H10W72/07233 (Ultrasonic bonding) appears on 474 US grants and 566 published applications in this corpus.
Search patents in H10W- Granted patents
- 474
- Published applications
- 566
- Assignees
- 213
- Inventors
- 979
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 4 | 0 |
| 1999 | 6 | 0 |
| 2000 | 3 | 0 |
| 2001 | 8 | 3 |
| 2002 | 6 | 14 |
| 2003 | 4 | 8 |
| 2004 | 10 | 12 |
| 2005 | 5 | 10 |
| 2006 | 8 | 27 |
| 2007 | 13 | 31 |
| 2008 | 18 | 35 |
| 2009 | 23 | 29 |
| 2010 | 28 | 27 |
| 2011 | 17 | 24 |
| 2012 | 29 | 20 |
| 2013 | 18 | 19 |
| 2014 | 17 | 17 |
| 2015 | 19 | 34 |
| 2016 | 26 | 39 |
| 2017 | 35 | 42 |
| 2018 | 22 | 41 |
| 2019 | 27 | 30 |
| 2020 | 27 | 26 |
| 2021 | 24 | 28 |
| 2022 | 25 | 17 |
| 2023 | 21 | 11 |
| 2024 | 10 | 12 |
| 2025 | 8 | 3 |
| 2026 | 4 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor manufacturing apparatus and method of manufacturing semiconductor device26 May 2026US 12,642,040 B2Mitsubishi Electric Corporation
- Bonding apparatus and bonding method using the same26 May 2026US 12,642,134 B2Samsung Display Co., Ltd.
- Integrated circuit packages to minimize stress on a semiconductor die27 Jan 2026US 12,538,804 B2Analog Devices International Unlimited Company
- Display device including connection wire and method for manufacturing the same13 Jan 2026US 12,527,083 B2Samsung Display Co., Ltd.
- Chip-last wafer-level fan-out with optical fiber alignment structure30 Dec 2025US 12,512,402 B2Ayar Labs, Inc.
- Semiconductor chip alignment method, bonding method, electronic component manufacturing device, and electronic component manufacturing system30 Jul 2026US 2026/0223714 A1Tokyo University of Science Foundation
- Semiconductor manufacturing apparatus and method of manufacturing semiconductor device23 Jul 2026US 2026/0215207 A1Mitsubishi Electric Corporation
- Display device and method for manufacturing display device25 Jun 2026US 2026/0182031 A1Samsung Display Co., Ltd.
- Element transcription method and element transcription device25 Jun 2026US 2026/0182105 A1Panasonic Intellectual Property Management Co., Ltd.
- Chip-Last Wafer-Level Fan-Out with Optical Fiber Alignment Structure30 Apr 2026US 2026/0123486 A1Ayar Labs, Inc.
Most cited
By later US patents
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Semiconductor integrated circuit chip-to-chip interconnection scheme256US 4,937,653 AAmerican Telephone and Telegraph Company · 1990
- Method for manufacturing raised electrical contact pattern of controlled geometry196US 6,215,670 B1FormFactor, Inc. · 2001
- Methods for making z-axis electrical connections155US 6,260,264 B13M Innovative Properties Company · 2001
- Surface mount semiconductor package, die-leadframe combination and leadframe therefor and method of mounting leadframes to surfaces of semiconductor die149US 6,307,755 B12001