H10W 72/07232
Compression bonding
Official title: {Compression bonding, e.g. thermocompression bonding}
H10W72/07232 (Compression bonding) appears on 2,256 US grants and 2,861 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,256
- Published applications
- 2,861
- Assignees
- 577
- Inventors
- 4,103
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 5 | 0 |
| 1998 | 5 | 0 |
| 1999 | 9 | 0 |
| 2000 | 5 | 0 |
| 2001 | 14 | 7 |
| 2002 | 12 | 26 |
| 2003 | 17 | 22 |
| 2004 | 20 | 35 |
| 2005 | 15 | 33 |
| 2006 | 23 | 73 |
| 2007 | 28 | 85 |
| 2008 | 34 | 68 |
| 2009 | 49 | 82 |
| 2010 | 74 | 81 |
| 2011 | 67 | 106 |
| 2012 | 77 | 106 |
| 2013 | 93 | 128 |
| 2014 | 97 | 144 |
| 2015 | 124 | 189 |
| 2016 | 169 | 170 |
| 2017 | 169 | 190 |
| 2018 | 144 | 165 |
| 2019 | 148 | 168 |
| 2020 | 139 | 203 |
| 2021 | 161 | 196 |
| 2022 | 140 | 155 |
| 2023 | 131 | 127 |
| 2024 | 121 | 135 |
| 2025 | 103 | 92 |
| 2026 | 53 | 75 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Cu—Cu direct welding for packaging application in semiconductor industry29 Sep 2026US 12,751,311 B2The University of Hong Kong
- Display device including a light emitting element connected to a first pad electrode and a second pad electrode and manufacturing method thereof22 Sep 2026US 12,745,458 B2Samsung Display Co., Ltd.
- Semiconductor package and method of manufacturing22 Sep 2026US 12,745,652 B2Samsung Electronics Co., Ltd.
- Radiant substrate heating for thermocompressive bonding and apparatus for implementing the same15 Sep 2026US 12,740,484 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package including a pad comprising a connection portion connecting a first and second pad portions1 Sep 2026US 12,727,496 B2Samsung Electronics Co., Ltd.
- Semiconductor Device and Method of Forming Fan-Out Wafer Level CPO with Through Silicon Conductive Via1 Oct 2026US 2026/0299219 A1STATS ChipPAC Pte. Ltd.
- Thermocompression bonding methods and buffer layers therefor1 Oct 2026US 2026/0305438 A1Purdue Research Foundation
- Hybrid Underfill Structures for Multi-Die Packages and Methods of Forming the Same1 Oct 2026US 2026/0305473 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Post-plasma clean infrared image inspection for oxideless bonding and apparatus for effecting the same17 Sep 2026US 2026/0278765 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor Device and Method of Forming Stacked Encapsulated Conductive Pillar Layers as Vertical Interconnect Structure17 Sep 2026US 2026/0282965 A1STATS ChipPAC Pte. Ltd.
Most cited
By later US patents
- Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same497US 6,887,769 B2Intel Corporation · 2005
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Multi-chip programmable logic device having configurable logic circuitry and configuration data storage on different dice399US 6,917,219 B2Xilinx, Inc. · 2005
- 3D IC method and device388US 7,485,968 B2Ziptronix, Inc. · 2009
- Methods for surface attachment of flipped active componenets316US 8,889,485 B2Semprius, Inc. · 2014