Semiconductor package and method of manufacturing

A method of manufacturing a semiconductor package, the method comprising:

• positioning at least one semiconductor element on an upper insulating layer of a package substrate,
• wherein the upper insulating layer of the package substrate exposes upper surfaces of first substrate pads and second substrate pads,
• each semiconductor element among the at least one semiconductor element includes electrodes on a lower surface of the at least one semiconductor element and respectively disposed in a peripheral region of the semiconductor element, solder members respectively on the electrodes, and an insulating spacer attached on the lower surface of the semiconductor element and disposed in a central portion of the semiconductor element between the solder members, wherein the insulating spacer extends outwardly from a center of the lower surface of the semiconductor element, and
• the solder members are respectively disposed on the second substrate pads;
• bonding the at least one semiconductor element on the package substrate using the solder members, thereby causing the insulating spacer to contact the package substrate, wherein the insulating spacer is spaced apart from the package substrate before bonding the at least one semiconductor element on the package substrate;
• and
• bonding a semiconductor device on the package substrate, wherein the semiconductor device is laterally spaced apart from the semiconductor element on the package substrate.