H10W 72/01225
In solid form
Official title: {in solid form, e.g. by using a powder or by stud bumping}
H10W72/01225 (In solid form) appears on 3,085 US grants and 3,108 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,085
- Published applications
- 3,108
- Assignees
- 561
- Inventors
- 4,212
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 4 | 0 |
| 1991 | 8 | 0 |
| 1992 | 12 | 0 |
| 1993 | 12 | 0 |
| 1994 | 14 | 0 |
| 1995 | 7 | 0 |
| 1996 | 22 | 0 |
| 1997 | 24 | 0 |
| 1998 | 42 | 0 |
| 1999 | 70 | 0 |
| 2000 | 66 | 0 |
| 2001 | 106 | 63 |
| 2002 | 103 | 140 |
| 2003 | 113 | 118 |
| 2004 | 105 | 120 |
| 2005 | 94 | 127 |
| 2006 | 100 | 109 |
| 2007 | 71 | 142 |
| 2008 | 68 | 136 |
| 2009 | 91 | 146 |
| 2010 | 107 | 127 |
| 2011 | 117 | 120 |
| 2012 | 107 | 124 |
| 2013 | 126 | 139 |
| 2014 | 104 | 166 |
| 2015 | 136 | 208 |
| 2016 | 197 | 174 |
| 2017 | 196 | 176 |
| 2018 | 173 | 144 |
| 2019 | 138 | 147 |
| 2020 | 129 | 132 |
| 2021 | 98 | 121 |
| 2022 | 99 | 90 |
| 2023 | 87 | 46 |
| 2024 | 74 | 47 |
| 2025 | 48 | 35 |
| 2026 | 8 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Sintered metal flip chip joints18 Aug 2026US 12,713,938 B2Texas Instruments Incorporated
- Method of bonding column type deposits21 Apr 2026US 12,610,841 B2Protec Co., Ltd.
- Integrated circuit package and method21 Apr 2026US 12,610,873 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package including an integrated circuit die and an inductor or a transformer24 Mar 2026US 12,588,222 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit package and method6 Aug 2026US 2026/0231829 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package and fabricating method thereof30 Jul 2026US 2026/0223740 A1Amkor Technology Singapore Holding Pte.Ltd.
- Wafer-scale integration power delivery with an isotropic conductive adhesive30 Jul 2026US 2026/0223754 A1Volantis Semiconductor, Inc.
- Semiconductor package including an integrated circuit die and an inductor or a transformer9 Jul 2026US 2026/0198021 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Under-bump metallization structure and methods of forming the same18 Jun 2026US 2026/0173940 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Embedded wafer-level bonding approaches616US 8,361,842 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Saw-singulated leadless plastic chip carrier427US 6,229,200 B1ASAT Ltd. · 2001