H10W 70/644
Elastic or compliant interconnections
Official title: {Elastic or compliant interconnections, e.g. springs, cantilevers or elastic pads}
H10W70/644 (Elastic or compliant interconnections) appears on 98 US grants and 225 published applications in this corpus.
Search patents in H10W- Granted patents
- 98
- Published applications
- 225
- Assignees
- 75
- Inventors
- 240
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 1 |
| 2002 | 1 | 4 |
| 2003 | 1 | 5 |
| 2004 | 4 | 3 |
| 2005 | 3 | 16 |
| 2006 | 6 | 12 |
| 2007 | 8 | 2 |
| 2008 | 2 | 8 |
| 2009 | 5 | 9 |
| 2010 | 6 | 4 |
| 2011 | 5 | 7 |
| 2012 | 10 | 12 |
| 2013 | 8 | 5 |
| 2014 | 2 | 4 |
| 2015 | 5 | 4 |
| 2016 | 4 | 4 |
| 2017 | 3 | 0 |
| 2018 | 6 | 7 |
| 2019 | 2 | 3 |
| 2020 | 0 | 3 |
| 2021 | 4 | 4 |
| 2022 | 4 | 3 |
| 2023 | 0 | 4 |
| 2024 | 1 | 4 |
| 2025 | 1 | 3 |
| 2026 | 2 | 94 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic assembly having a power semiconductor component between two circuit carriers, and method for producing same11 Aug 2026US 12,707,570 B2Robert Bosch GmbH
- Three-dimensional circuits with flexible interconnects6 Jan 2026US 12,520,425 B2Dujud LLC
- Connection assembly, board-level architecture, and computing device16 Sep 2025US 12,418,985 B2Huawei Technologies Co., Ltd.
- Semiconductor devices with flexible connector array20 Feb 2024US 11,908,803 B2Micron Technology, Inc.
- Electronic module and method for manufacturing electronic module6 Sep 2022US 11,437,298 B2Shindengen Electric Manufacturing Co., Ltd.
- Interposer10 Sep 2026US 2026/0271756 A1Te Connectivity Japan G.K.
- Compression interposer and interconnect system3 Sep 2026US 2026/0262516 A1Samtec, Inc.
- Simultaneous Silicon Spring and Chip Singulation DRIE13 Aug 2026US 2026/0239987 A1
- High Current Column Grid Array Pillars13 Aug 2026US 2026/0240010 A1
- Targeted Jet-Cooling System for Zetta-Scale Computing Assemblies16 Jul 2026US 2026/0202891 A1
Most cited
By later US patents
- Lithographic contact elements265US 6,255,126 B1FormFactor, Inc. · 2001
- Flexible lead structures and methods of making same133US 6,828,668 B2Tessera, Inc. · 2004
- Wire segment based interposer for high frequency electrical connection125US 6,264,476 B1High Connection Density, Inc. · 2001
- Flexible circuitized interposer with apertured member and method for making same105US 5,984,691 AInternational Business Machines Corporation · 1999
- Flexible circuitized interposer with apertured member and method for making same94US 5,759,047 AInternational Business Machines Corporation · 1998