Connection assembly, board-level architecture, and computing device

A board-level architecture, comprising:

• a semiconductor wafer;
• a lower layer substrate;
• an upper bracket;
• a lower bracket;
• and
• a connection assembly having an insulator structure and a plurality of connection terminals disposed at spacings, wherein
• a connection terminal, of the plurality of connection terminals, includes a first end and a second end, and the first end and the second end each are provided with a welding structure,
• the first end and the second end are opposite ends of the connection terminal,
• the first end is welded to the semiconductor wafer through the welding structure,
• the second end is welded to the lower layer substrate through the welding structure,
• the insulator structure includes a plurality of empty slots provided at the spacings,
• positions of the plurality of empty slots are in a one-to-one correspondence with positions of the plurality of connection terminals, and
• at least one of the plurality of connection terminals is disposed in a corresponding empty slot, from the plurality of empty slots, to fasten a position of the connection terminal, wherein
• the connection assembly is disposed between the semiconductor wafer and the lower layer substrate, to connect the semiconductor wafer to the lower layer substrate,
• a plurality of first solder pads are disposed on a surface of the semiconductor wafer close to the connection terminal,
• a plurality of second solder pads are disposed on a surface of the lower layer substrate close to the connection terminal,
• the plurality of first solder pads and the plurality of second solder pads are respectively connected to first ends and second ends of a plurality of corresponding connection terminals,
• the upper bracket is fastened to an upper surface of the lower layer substrate through a connection part,
• the lower bracket is fastened to a lower surface of the lower layer substrate through the connection part, and
• the upper bracket comprises at least one empty slot region provided at spacings, and at least one connection assembly is disposed in a corresponding empty slot region.

A computing device, comprising:

• a cooling system;
• and
• a board-level architecture, wherein the board-level architecture includes a semiconductor wafer, a lower layer substrate, an upper bracket, a lower bracket, and a connection assembly having an insulator structure and a plurality of connection terminals disposed at spacings, wherein
• a connection terminal, of the plurality of connection terminals, includes a first end and a second end, and the first end and the second end each are provided with a welding structure, the first end and the second end are opposite ends of the connection terminal, the first end is welded to the semiconductor wafer through the welding structure, and the second end is welded to the lower layer substrate through the welding structure,
• the insulator structure includes a plurality of empty slots provided at the spacings, positions of the plurality of empty slots are in a one-to-one correspondence with positions of the plurality of connection terminals, at least one of the plurality of connection terminals is disposed in a corresponding empty slot, from the plurality of empty slots, to fasten a position of the connection terminal, and the connection assembly is disposed between the semiconductor wafer and the lower layer substrate, to connect the semiconductor wafer to the lower layer substrate,
• a plurality of first solder pads are disposed on a surface of the semiconductor wafer close to the connection terminal, a plurality of second solder pads are disposed on a surface of the lower layer substrate close to the connection terminal, and the plurality of first solder pads and the plurality of second solder pads are respectively connected to first ends and second ends of a plurality of corresponding connection terminals,
• the upper bracket is fastened to an upper surface of the lower layer substrate through a connection part, and the lower bracket is fastened to a lower surface of the lower layer substrate through the connection part, and
• the upper bracket includes at least one empty slot region provided at the spacings, at least one connection assembly is disposed in a corresponding empty slot region, and the cooling system is disposed on an upper surface of a semiconductor wafer to dissipate heat for a wafer structure.