Flexible lead structures and methods of making same

An interconnect component comprising a compliant layer having a first surface and a plurality of electrically conductive leads having first ends and extending through said compliant layer, said electrically conductive leads being flexible and adapted to deform in conjunction with deformation of the compliant layer, said first ends extending generally parallel to said first surface.

An interconnect component comprising a compliant layer and a plurality of electrically conductive leads having first ends and extending through said compliant layer, said first ends comprising elongated portions of said leads exposed at a first surface of said compliant layer and being located at or near said first surface, wherein said leads have midsections with a width less than the width of said first ends.

An interconnect component comprising a compliant layer and a plurality of electrically conductive leads having first ends and extending through said compliant layer, said first ends comprising elongated portions of said leads exposed at a first surface of said compliant layer and being located at or near said first surface, a releasable bonding material on said first ends.

An interconnect component comprising a compliant layer and a plurality of electrically conductive leads having first ends and extending through said compliant layer, said first ends comprising elongated portions of said leads exposed at a first surface of said compliant layer and being located at or near said first surface, a temporary support structure, said first end being connected to said temporary support structure.

An interconnect component comprising a compliant layer and a plurality of electrically conductive leads having first ends and extending through said compliant layer, said first ends comprising elongated portions of said leads exposed at a first surface of said compliant layer and being located at or near said first surface, wherein said compliant layer has a second surface opposite said first surface, wherein said leads have second ends opposite said first ends, said second ends being located at or near the second surface of the compliant layer, a first temporary support structure and a second temporary support structure.

An interconnect component comprising a compliant layer having a first surface and a plurality of electrically conductive leads having first ends and extending through said compliant layer, said first ends extending generally parallel to said first surface, wherein said leads have midsections with a width less than the width of said first ends.

An interconnect component comprising a compliant layer having a first surface and a plurality of electrically conductive leads having first ends and extending through said compliant layer, said first ends extending generally parallel to said first surface, wherein said compliant layer has a second surface opposite said first surface, wherein said leads have second ends opposite said first ends, said first ends being located at or near the first surface and said second ends being located at or near the second surface of the compliant layer, wherein said leads have midsections with a width less than the width of said first ends.

An interconnect component comprising a compliant layer having a first surface and a plurality of electrically conductive leads having first ends and extending through said compliant layer, said first ends extending generally parallel to said first surface, a temporary support structure, said first end being connected to said temporary support structure.

An interconnect component comprising a compliant layer having a first surface and a plurality of electrically conductive leads having first ends and extending through said compliant layer, said first ends extending generally parallel to said first surface, a releasable bonding material on said first ends.

An interconnect component comprising a compliant layer having a first surface and a plurality of electrically conductive leads having first ends and extending through said compliant layer, said first ends extending generally parallel to said first surface, wherein said compliant layer has a second surface opposite said first surface, wherein said leads have second ends opposite said first ends, said first ends being located at or near the first surface and said second ends being located at or near the second surface of the compliant layer, a releasable bonding material on said first ends.

An interconnect component comprising a compliant layer having a first surface and a plurality of electrically conductive leads having first ends and extending through said compliant layer, said first ends extending generally parallel to said first surface, wherein said compliant layer has a second surface opposite said first surface, wherein said leads have second ends opposite said first ends, said first ends being located at or near the first surface and said second ends being located at or near the second surface of the compliant layer, a first temporary support structure and a second temporary support structure.