US 11,908,803 B2Granted

Semiconductor devices with flexible connector array

AssigneeMicron Technology, Inc.

InventorsKoustav Sinha, Xiaopeng Qu

Life of this patent

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Abstract

A semiconductor device includes an array of flexible connectors configured to mitigate thermomechanical stresses. In one embodiment, a semiconductor assembly includes a substrate coupled to an array of flexible connectors. Each flexible connector can be transformed between a resting configuration and a loaded configuration. Each flexible connector includes a conductive wire electrically coupled to the substrate and a support material at least partially surrounding the conductive wire. The conductive wire has a first shape when the flexible connector is in the resting configuration and a second, different shape when the flexible connector is in the loaded configuration. The first shape includes at least two apices spaced apart from each other in a vertical dimension by a first distance, and the second shape includes the two apices spaced apart from each other in the vertical dimension by a second distance different than the first distance.

Claims11

Dependent claims

A semiconductor assembly, comprising:

a substrate;
and
an array of flexible connectors coupled to the substrate, each flexible connector transformable between a resting configuration and a loaded configuration, wherein each flexible connector includes:
a conductive wire electrically coupled to the substrate, the conductive wire having an end portion with a greater cross-sectional area than a middle portion, a first shape when the flexible connector is in the resting configuration and a second shape when the flexible connector is in the loaded configuration, the second shape differing from the first shape,
wherein the first shape includes at least two apices spaced apart from each other in a vertical dimension by a first distance, and
wherein the second shape includes the at least two apices spaced apart from each other in the vertical dimension by a second distance, wherein the second distance is different than the first distance, and
a support material at least partially surrounding the conductive wire.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/750,665Filed 23 May 2022 · continuation
Priority: 27 Feb 2020
Published: US 2022/0285281 A18 Sep 2022
Granted: 20 Feb 2024
Term ends: Not estimatedThe source records don’t support an estimate.

Classification28 codes

H05K 3/3436
Leadless components: having an array of bottom contacts, e.g. pad grid array or ball grid array components
H10W 70/611
Insulating or insulated package substrates; Interposers; Redistribution layers: for connecting multiple chips together
H05K 1/189
Structurally associated with non-printed electric components: characterised by the use of flexible or folded printed circuits
H10W 70/644
Characterised by their interconnections: elastic or compliant interconnections, e.g. springs, cantilevers or elastic pads

Family

Application16/803,954Parent of this continuation · filed 27 Feb 2020
US 2022/0285281 A1Pre-grant publication · published 8 Sep 2022
US 11,348,875 B2Parent of this continuation
US 2021/0272908 A1Published application
US 11,908,803 B2This patent

From the US filing history. Foreign family members aren’t listed.