H10W 42/287
Materials for magnetic shielding
Official title: {materials for magnetic shielding, e.g. ferromagnetic materials}
H10W42/287 (Materials for magnetic shielding) appears on 380 US grants and 419 published applications in this corpus.
Search patents in H10W- Granted patents
- 380
- Published applications
- 419
- Assignees
- 159
- Inventors
- 807
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 0 | 0 |
| 2001 | 3 | 8 |
| 2002 | 10 | 17 |
| 2003 | 11 | 16 |
| 2004 | 12 | 21 |
| 2005 | 24 | 22 |
| 2006 | 15 | 14 |
| 2007 | 6 | 9 |
| 2008 | 9 | 16 |
| 2009 | 13 | 18 |
| 2010 | 12 | 16 |
| 2011 | 13 | 15 |
| 2012 | 23 | 25 |
| 2013 | 16 | 7 |
| 2014 | 14 | 16 |
| 2015 | 9 | 15 |
| 2016 | 18 | 15 |
| 2017 | 17 | 28 |
| 2018 | 27 | 25 |
| 2019 | 26 | 25 |
| 2020 | 20 | 17 |
| 2021 | 17 | 17 |
| 2022 | 8 | 16 |
| 2023 | 13 | 17 |
| 2024 | 10 | 11 |
| 2025 | 15 | 2 |
| 2026 | 4 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus and method for selectively forming a shielding layer on a semiconductor package18 Aug 2026US 12,713,931 B2
- Semiconductor device and method of forming high crystal quality magnetic layer for shielding of low frequency magnetic fields26 May 2026US 12,642,101 B2STATS ChipPAC Pte. Ltd.
- Isolator17 Mar 2026US 12,580,123 B2Kabushiki Kaisha Toshiba
- Manufacturing method of package with magnetic shielding structure17 Mar 2026US 12,581,865 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Electronics module with shield structure2 Dec 2025US 12,489,024 B2Murata Manufacturing Co., Ltd.
- Package module and manufacturing method therefor, power supply module, and electronic device10 Sep 2026US 2026/0271735 A1Huawei Technologies Co., Ltd.
- Manufacturing method of package with magnetic shielding structure23 Jul 2026US 2026/0215164 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor Device and Method of Forming Power IC as PMIC with Magnetic Core30 Apr 2026US 2026/0123428 A1STATS ChipPAC Management Pte. Ltd.
- Dc and ac magnetic field protection for mram device using magnetic-field-shielding structure30 Apr 2026US 2026/0123441 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Component Carrier With Inorganic Carrier Having Inserted Pin Directly Encapsulated in Through Hole5 Mar 2026US 2026/0068037 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Most cited
By later US patents
- Shielded electronic component assembly and method for making the same392US 5,639,989 AMotorola, Inc. · 1997
- Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same291US 9,461,001 B1Advanced Semiconductor Engineering, Inc. · 2016
- Method of forming a semiconductor package and structure thereof283US 7,030,469 B2Freescale Semiconductor, Inc. · 2006
- Multilayer structures for magnetic shielding206US 7,795,708 B2Honeywell International Inc. · 2010
- Magnetic shielding of MRAM package190US 9,875,971 B2Globalfoundries Singapore Pte. Ltd. · 2018