Dc and ac magnetic field protection for mram device using magnetic-field-shielding structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHarry-Hak-Lay Chuang, Tien-Wei Chiang, Kuo-An Liu, Chia-Hsiang Chen
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Abstract
In some embodiments, the present application provides an integrated circuit (IC) structure. The IC structure includes one or more electronic devices. An outer structure is adjacent to the IC chip. The outer structure comprises a first region adjacent to a first surface of the IC chip. The first region comprises a first shielding segment and a second shielding segment having a surface facing and offset from a surface of the first shielding segment.
Claims20
An integrated circuit (IC) structure, comprising:
- an IC chip comprising one or more electronic devices;
- and
- an outer structure adjacent to the IC chip, wherein the outer structure comprises a first region adjacent to a first surface of the IC chip, wherein the first region comprises a first shielding segment and a second shielding segment having a surface facing and offset from a surface of the first shielding segment.
An integrated circuit (IC) structure, comprising:
- a package structure including an IC chip, wherein the package structure comprises a first horizontal surface, a second horizontal surface, and a pair of sidewalls extending between the first and second horizontal surfaces;
- and
- an outer structure on the package structure and having a first lateral protective structure on the first horizontal surface and a first vertical structure on a first sidewall of the pair of sidewalls, wherein the first vertical structure comprises one or more openings horizontally aligned with the IC chip, wherein the first lateral protective structure comprises a first plurality of conductive structures facing the first horizontal surface and spaced apart from one another.
A method for forming a package structure, comprising:
- forming a composite structure comprising a first shielding segment, a second shielding segment, and a dielectric layer between the first shielding segment and the second shielding segment;
- and
- disposing the composite structure on a first surface of an integrated circuit (IC) structure comprising an IC chip.
Dependencies are inferred from the claim text.