H10W 42/281
Characterised by their materials
Official title: {characterised by their materials}
H10W42/281 (Characterised by their materials) appears on 521 US grants and 602 published applications in this corpus.
Search patents in H10W- Granted patents
- 521
- Published applications
- 602
- Assignees
- 211
- Inventors
- 1,171
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 0 | 0 |
| 2001 | 4 | 8 |
| 2002 | 11 | 20 |
| 2003 | 13 | 19 |
| 2004 | 13 | 23 |
| 2005 | 25 | 26 |
| 2006 | 17 | 18 |
| 2007 | 7 | 15 |
| 2008 | 9 | 24 |
| 2009 | 15 | 20 |
| 2010 | 18 | 22 |
| 2011 | 19 | 22 |
| 2012 | 31 | 34 |
| 2013 | 20 | 10 |
| 2014 | 16 | 21 |
| 2015 | 16 | 24 |
| 2016 | 27 | 22 |
| 2017 | 25 | 47 |
| 2018 | 37 | 38 |
| 2019 | 47 | 46 |
| 2020 | 33 | 32 |
| 2021 | 29 | 24 |
| 2022 | 15 | 23 |
| 2023 | 18 | 23 |
| 2024 | 14 | 16 |
| 2025 | 21 | 5 |
| 2026 | 5 | 20 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Apparatus and method for selectively forming a shielding layer on a semiconductor package18 Aug 2026US 12,713,931 B2
- Semiconductor device and method of forming high crystal quality magnetic layer for shielding of low frequency magnetic fields26 May 2026US 12,642,101 B2STATS ChipPAC Pte. Ltd.
- Resin composition17 Mar 2026US 12,577,331 B2Namics Corporation
- Isolator17 Mar 2026US 12,580,123 B2Kabushiki Kaisha Toshiba
- Manufacturing method of package with magnetic shielding structure17 Mar 2026US 12,581,865 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device including charge shielding layer8 Oct 2026US 2026/0314426 A1Samsung Electronics Co., Ltd.
- Electromagnetic compartmental shielding for multichip cavity system-in-package (sip) module17 Sep 2026US 2026/0282931 A1Qorvo US, Inc.
- Package module and manufacturing method therefor, power supply module, and electronic device10 Sep 2026US 2026/0271735 A1Huawei Technologies Co., Ltd.
- Electromagnetic interference shielding film comprising heterogeneously stacked metal-mxene and method for preparing the same27 Aug 2026US 2026/0255565 A1Gwangju Institute of Science and Technology
- Semiconductor package6 Aug 2026US 2026/0231775 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Shielded electronic component assembly and method for making the same392US 5,639,989 AMotorola, Inc. · 1997
- Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same291US 9,461,001 B1Advanced Semiconductor Engineering, Inc. · 2016
- Method of forming a semiconductor package and structure thereof283US 7,030,469 B2Freescale Semiconductor, Inc. · 2006
- Multilayer structures for magnetic shielding206US 7,795,708 B2Honeywell International Inc. · 2010
- Magnetic shielding of MRAM package190US 9,875,971 B2Globalfoundries Singapore Pte. Ltd. · 2018