Package module and manufacturing method therefor, power supply module, and electronic device

A method for manufacturing a package module, comprising:

• forming a second layer and a plurality of connectors, wherein the connectors are vertically disposed on a surface of the second layer;
• forming a magnetic energy storage layer, wherein the magnetic energy storage layer and the connector are alternately disposed on the surface of the second layer, the magnetic energy storage layer includes a magnetic material, and the magnetic energy storage layer comprises:
• a first surface of the magnetic energy storage layer;
• and
• a second surface of the magnetic energy storage layer opposite from the first surface of the magnetic energy storage layer;
• forming a first layer that covers the connector and the first surface of the magnetic energy storage layer;
• and
• arranging a chip on a side of the first layer and is away from the magnetic energy storage layer, and electrically connecting the chip to the first layer.

A power supply module, comprising:

• a first heat sink;
• a second heat sink;
• a power supply;
• a power supply chip;
• a package module;
• and
• a trace board layer, wherein the trace board layer has a second through hole and a third through hole,
• wherein each of the power supply, the power supply chip, and the package module are disposed at the trace board layer, the package module is electrically connected to the power supply by the second through hole, and the package module is electrically connected to the power supply chip by the third through hole;
• wherein the first heat sink is on a side of the power supply chip and that is away from the trace board layer;
• wherein the second heat sink is on a side of the package module and that is away from the trace board layer,
• wherein the package module comprises a package module, wherein the package module comprises:
• a magnetic energy storage layer, wherein the magnetic energy storage layer includes a magnetic material, and the magnetic energy storage layer comprises:
• a first surface of the magnetic energy storage layer;
• and
• a second surface of the magnetic energy storage layer;
• opposite from the first surface of the magnetic energy storage layer;
• a trace layer comprising:
• a first layer of the trace layer,
• a second layer of the trace layer, and
• connectors,
• wherein the first layer of the trace layer is on the first surface of the magnetic energy storage layer, the second layer of the trace layer is on the second surface of the magnetic energy storage layer, and the connector penetrates the magnetic energy storage layer and is separately connected to the first layer of the trace layer and the second layer of the trace layer;
• and
• a chip on a side of the first layer and away from the magnetic energy storage layer, and the chip is electrically connected to the first layer of the trace layer.