H10W 42/284
Shielding resins
Official title: {shielding resins}
H10W42/284 (Shielding resins) appears on 210 US grants and 265 published applications in this corpus.
Search patents in H10W- Granted patents
- 210
- Published applications
- 265
- Assignees
- 113
- Inventors
- 550
- Latest grant
- 17 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 2 | 5 |
| 2003 | 3 | 5 |
| 2004 | 3 | 4 |
| 2005 | 3 | 7 |
| 2006 | 3 | 6 |
| 2007 | 2 | 8 |
| 2008 | 0 | 9 |
| 2009 | 3 | 3 |
| 2010 | 6 | 10 |
| 2011 | 8 | 8 |
| 2012 | 9 | 10 |
| 2013 | 6 | 5 |
| 2014 | 3 | 5 |
| 2015 | 8 | 11 |
| 2016 | 11 | 11 |
| 2017 | 14 | 37 |
| 2018 | 22 | 23 |
| 2019 | 29 | 29 |
| 2020 | 21 | 21 |
| 2021 | 16 | 12 |
| 2022 | 10 | 14 |
| 2023 | 8 | 7 |
| 2024 | 7 | 7 |
| 2025 | 10 | 5 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Resin composition17 Mar 2026US 12,577,331 B2Namics Corporation
- Semiconductor device package having improved conductive stub coverage25 Nov 2025US 12,482,761 B2SanDisk Technologies LLC
- Electronic package18 Nov 2025US 12,476,229 B2Siliconware Precision Industries Co., Ltd.
- Multilayer tape including plurality of magnetic metal particles and electronic assembly including the same11 Nov 2025US 12,471,263 B23M Innovative Properties Company
- Packaging structure and fabrication method thereof7 Oct 2025US 12,438,098 B2Nantong Tongfu Microelectronics Co., Ltd
- Semiconductor package6 Aug 2026US 2026/0231775 A1Samsung Electronics Co., Ltd.
- Electronic package12 Feb 2026US 2026/0047498 A1Siliconware Precision Industries Co., Ltd.
- High frequency devices including attenuating dielectric materials29 Jan 2026US 2026/0033343 A1Infineon Technologies AG
- Production method for semiconductor packages18 Dec 2025US 2025/0385104 A1Resonac Corporation
- Packaging structure4 Dec 2025US 2025/0372532 A1Nantong Tongfu Microelectronics Co., Ltd
Most cited
By later US patents
- Method of making near chip size integrated circuit package130US 6,962,829 B2Amkor Technology, Inc. · 2005
- Magnetic and electric shielding of on-board devices84US 6,566,596 B1Intel Corporation · 2003
- Radiation enhanced chip encapsulant75US 5,998,867 AHoneywell Inc. · 1999
- Semiconductor device package and manufacturing method73US 7,700,411 B2Advanced Semiconductor Engineering, Inc. · 2010
- Solid state drive package63US 10,109,617 B2Samsung Electronics Co., Ltd. · 2018