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US 2025/0385104 A1Published application
Production method for semiconductor packages
AssigneeResonac Corporation
InventorsHirokazu NOMA, Tomohiro HAYASHI, Yuma TAKEUCHI, Kasumi NAKAMURA
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Abstract
A production method for semiconductor packages according to the present disclosure includes: adhering an adhesive material to a surface of a first sealing material, peeling off the adhesive material from the surface of the first sealing material, and providing a second member to the surface of the first sealing material from which the adhesive material was peeled off.
Claims4
A production method for a semiconductor package, the method comprising:
- adhering an adhesive material to a surface of a first sealing material;
- peeling off the adhesive material from the surface of the first sealing material;
- and
- providing a second member to the surface of the first sealing material from which the adhesive material was peeled off.
1 more element
Dependencies are inferred from the claim text.