Semiconductor device package and manufacturing method
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsJun Young Yang, You Ock Joo, Dong Pil Jung
Life of this patent
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Abstract
A semiconductor device package includes a semiconductor device mounted and electrically coupled to a substrate, a package body encapsulating the semiconductor device against a portion of an upper surface of the substrate; and an electromagnetic interference shielding layer formed over the package body and substantially enclosing the semiconductor device. The present invention further provides methods for manufacturing the semiconductor device package.
Claims10
A method for manufacturing a plurality of semiconductor device packages, the method comprising:
- attaching a plurality of semiconductor devices onto a substrate strip including a plurality of substrates, each substrate having at least one ground trace extending on an upper surface of the substrate;
- electrically coupling the semiconductor devices to the substrate strip;
- encapsulating the semiconductor devices against an upper surface of the substrate strip to form a plurality of individual package bodies each encapsulating at least one of the semiconductor devices on the substrate strip wherein each of the ground traces is positioned between two adjacent package bodies;
- and
- applying an electromagnetic interference shielding layer directly over each of the package bodies such that the electromagnetic interference shielding layer is connected to at least one of the ground traces.
A method for manufacturing a plurality of semiconductor device packages, the method comprising:
- attaching a plurality of semiconductor devices onto a substrate strip including a plurality of substrates, each substrate having at least one ground trace extending on an upper surface of the substrate;
- electrically coupling the semiconductor devices to the substrate strip;
- encapsulating the semiconductor devices against an upper surface of the substrate strip to form a plurality of package bodies each encapsulating at least one of the semiconductor devices on the substrate strip, wherein each of the ground traces is positioned between adjacent package bodies;
- and
- providing an electromagnetic interference shielding layer over each of the package bodies such that the electromagnetic interference shielding layer is connected to at least one of the ground traces,
- wherein the electromagnetic interference shielding layer has a main body and a side wall extending from the main body, and the side wall of the electromagnetic interference shielding layer is substantially flush with a side surface of a respective substrate, so as to define a substantially coplanar side surface.
A method for manufacturing a plurality of semiconductor device packages, the method comprising:
- attaching a plurality of semiconductor devices onto a substrate strip including a plurality of substrates, each substrate having at least one ground trace extending on an upper surface of the substrate;
- electrically coupling the semiconductor devices to the substrate strip;
- encapsulating the semiconductor devices against an upper surface of the substrate strip to form a molded product;
- conducting singulation to separate the molded product into a plurality of individual molded units;
- and
- providing an electromagnetic interference shielding layer over each of the separated molded units.
Dependencies are inferred from the claim text.