Multilayer tape including plurality of magnetic metal particles and electronic assembly including the same

An electronic assembly comprising:

• a circuit board comprising an electro-conductive trace and a first edge surface;
• an electronic element mounted on the circuit board, electrically connected to the electro-conductive trace, and comprising a lateral edge spatially spaced apart from the first edge surface;
• a protection layer disposed on the electronic element, substantially surrounding the electronic element, and having a planar top surface;
• and
• an electromagnetic interference (EMI) absorption layer disposed on the protection layer through an adhesive layer, and bonded to the protection layer,
• wherein the first edge surface connects a major top surface and a major bottom surface of the protection layer,
• wherein an average thickness of the protection layer is equal to or greater than a height of the electronic element,
• wherein the protection layer comprises a second edge surface connecting a major top surface and a major bottom surface of the protection layer,
• wherein the EMI absorption layer comprises a resin and a plurality of magnetic metal particles which are distributed in the resin,
• wherein the EMI absorption layer and the protection layer comprise a coupled third edge surface which connects a major top surface of the EMI absorption layer and the major bottom surface of the protection layer,
• wherein the first edge surface, the second edge surface, and the third edge surface are substantially aligned with one another, thereby forming a substantially planar coupling edge surface.

An electronic assembly comprising:

• a circuit board comprising a plurality of electro-conductive traces;
• a plurality of spaced-apart semiconductor integrated circuits which are mounted on the circuit board and are electrically connected to the plurality of electro-conductive traces;
• a protection layer disposed on the semiconductor integrated circuits, substantially surrounding the semiconductor integrated circuits, and having a planar top surface;
• and
• an EMI protection layer disposed on the protection layer through an adhesive layer, and bonded to the protection layer,
• wherein the EMI protection layer comprises a resin and a plurality of magnetic metal particles which are distributed in the resin,
• wherein the magnetic metal particles comprise iron, silicon, and aluminum,
• wherein a ratio of a gross weight of the plurality of magnetic metal particles to a gross weight of the EMI absorption layer is higher than about 40%.