Radiation enhanced chip encapsulant
AssigneeHoneywell Inc.
InventorsRonald J. Jensen, Richard K. Spielberger, Toan Dinh Nguyen, William F. Jacobsen
Life of this patent
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Abstract
A shielding apparatus for an electronic component includes a first insulative encapsulant surrounding at least a portion of the component and a second encapsulant surrounding said first encapsulant and having conductive particles dispersed therein for absorbing ionizing radiation.
Claims37
Apparatus for shielding a semiconductor die mounted on a surface from ionizing radiation, comprising:
- a first layer of initially flowable first material contacting and surrounding at least a first portion of said die;
- a second layer of initially flowable second material covering said first layer, said second material having dispersed therein particles of a metal, having a capacity for absorbing ionizing radiation;
- and
- ionizing radiation shielding means located to shield a second portion of said die.
Apparatus for shielding a semiconductor die mounted on a surface, comprising:
- a first formable electrically insulating encapsulant covering said die and a first portion of said surface;
- a second formable encapsulant covering said first encapsulant and a second portion of said surface, said second encapsulant having dispersed therein particles of a material having a capacity for absorbing ionizing radiation;
- and
- ionizing radiation shielding means located to shield an uncovered portion of said die.
Apparatus for shielding a semiconductor die mounted on a surface from ionizing radiation, comprising:
- a first layer of initially flowable first material contacting and surrounding at least a first portion of said die;
- a second layer of initially flowable second material covering said first layer, said second material having dispersed therein particles of a metal, having an atomic number of 70 or greater;
- and
- ionizing radiation shielding means located to shield a second portion of said die.
Apparatus for shielding a semiconductor die mounted at a surface from ionizing radiation comprising:
- a first layer of an initially flowable material having dispersed therein particles of a metal having a capacity for absorbing ionizing radiation, said first layer covering at least a portion of said die, said particles being sufficiently separated within said initially flowable material so that said first layer is electrically insulative.
Apparatus for shielding a semiconductor die mounted at a surface from ionizing radiation comprising:
- a first layer of initially flowable material having dispersed therein particles of a metal having a capacity for absorbing ionizing radiation, said first layer surrounding at least a portion of said die.
Dependencies are inferred from the claim text.