Solid state drive package
AssigneeSamsung Electronics Co., Ltd.
InventorsKwang-Ryul Lee, Boseong Kim, Taeduk Nam, Wangju Lee
Life of this patent
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Abstract
A solid state drive package is provided. The solid state drive package may include an integrated circuit substrate including: a lower redistribution layer; a first chip and a second chip provided on the lower redistribution layer; and a connection substrate provided on the lower redistribution layer, the connection substrate provided on an outer periphery of the first chip and the second chip; and a plurality of third chips provided on the integrated circuit substrate. The plurality of third chips are electrically connected to the first chip and the second chip via the connection substrate and the lower redistribution layer.
Claims20
A solid state drive (SSD) package, comprising:
- an integrated circuit substrate comprising:
- a lower redistribution layer;
- a volatile memory and a memory controller, the volatile memory and the memory controller being provided on the lower redistribution layer;
- and
- a connection substrate provided on the lower redistribution layer, the connection substrate provided on an outer periphery of the volatile memory and an outer periphery of the memory controller;
- a plurality of nonvolatile memory devices provided on the integrated circuit substrate;
- an upper mold layer provided on a top surface of the integrated circuit substrate to cover the plurality of nonvolatile memory devices;
- and
- a shielding layer extending from side surfaces of the integrated circuit substrate to side surfaces of the upper mold layer and a top surface of the upper mold layer,
- wherein the plurality of nonvolatile memory devices are electrically connected to the volatile memory and the memory controller via the connection substrate and the lower redistribution layer.
A solid state drive (SSD) package, comprising:
- an integrated circuit substrate comprising:
- a lower redistribution layer;
- a first chip and a second chip, the first chip and the second chip being provided on the lower redistribution layer;
- and
- a connection substrate provided on the lower redistribution layer, the connection substrate provided on an outer periphery of the first chip and an outer periphery of the second chip;
- a plurality of third chips provided on the integrated circuit substrate;
- an upper mold layer provided on a top surface of the integrated circuit substrate to cover the plurality of third chips;
- and
- a shielding layer extending from side surfaces of the integrated circuit substrate to side surfaces of the upper mold layer and a top surface of the upper mold layer,
- wherein the plurality of third chips are electrically connected to the first chip and the second chip via the connection substrate and the lower redistribution layer.
A solid state drive (SSD) package, comprising:
- an integrated circuit substrate comprising:
- a first redistribution layer;
- a first chip and a second chip, the first chip and the second chip being provided on the first redistribution layer;
- and
- a connection substrate provided on the first redistribution layer, the connection substrate provided on an outer periphery of the first chip and the second chip;
- an upper package provided on the integrated circuit substrate and comprising:
- a package substrate;
- and
- a plurality of third chips stacked on the package substrate;
- a connection layer provided between the integrated circuit substrate and the upper package;
- and
- a shielding layer extending from side surfaces of the integrated circuit substrate to side surfaces of the upper package, side surfaces of the connection layer, and a top surface of the upper package,
- wherein the connection layer comprises at least one of a second redistribution layer and a connection terminal layer, and
- wherein the plurality of third chips are electrically connected to the first chip via the connection substrate and the first redistribution layer.
Dependencies are inferred from the claim text.