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US 12,577,331 B2Granted
Resin composition
AssigneeNamics Corporation
InventorMasayoshi Otomo
Life of this patent
Estimating the term…
Abstract
A resin composition suppresses unintended curing of a 2-methylene-1,3-dicarbonyl compound in the presence of conductive particles to facilitate the production of a paste including the 2-methylene-1,3-dicarbonyl compound for electronic components. The resin composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) at least one type of conductive particles and (c) at least one monocarboxylic acid with a number of carbon atoms of 3 or more.
Claims19
A resin composition comprising the following components (a) to (c):
- (a) at least one 2-methylene-1,3-dicarbonyl compound;
- (b) at least one type of conductive particles;
- and
- (c) at least one monocarboxylic acid with a number of carbon atoms of 3 or more.
1 more element
Dependencies are inferred from the claim text.