Back to results
US 12,476,229 B2Granted
Electronic package
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsChih-Hsien Chiu, Wen-Jung Tsai, Chi-Ching Ho
Life of this patent
Estimating the term…
Abstract
An electronic package is provided, in which a circuit structure is stacked on a carrier structure having a routing layer via support structures, where electronic elements are disposed on upper and lower sides of the circuit structure and the carrier structure, and the electronic elements and the support structures are encapsulated by a cladding layer, such that the electronic package can effectively increase the packaging density to meet the requirements of multi-functional end products.
Claims11
An electronic package, comprising:
- a carrier structure having a routing layer and defined with a first side and a second side opposing the first side;
- a plurality of first electronic elements disposed on the first side and the second side of the carrier structure respectively and electrically connected to the routing layer;
- support structures disposed on the first side of the carrier structure and electrically connected to the routing layer;
- a circuit structure having a first surface and a second surface opposing the first surface and stacked on the first side of the carrier structure with the first surface via the support structures, wherein the support structures are electrically connected to the circuit structure, and a layout width of the circuit structure is less than a layout width of the carrier structure, such that an accommodating space is formed above the first side of the carrier structure;
- a plurality of second electronic elements disposed on the first surface and the second surface of the circuit structure respectively and electrically connected to the circuit structure;
- and
- a cladding layer formed on the first side and the second side of the carrier structure and on the first surface and the second surface of the circuit structure to encapsulate the plurality of first electronic elements, the plurality of second electronic elements and the support structures.
4 more elements
Dependencies are inferred from the claim text.