Back to results
US 12,581,865 B2Granted
Manufacturing method of package with magnetic shielding structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHarry-Hak-Lay Chuang, Yuan-Jen Lee, Tien-Wei Chiang
Life of this patent
Estimating the term…
Abstract
A package structure includes an integrated circuit package and a magnetic shielding structure. The integrated circuit package includes a semiconductor chip. The magnetic shielding structure surrounds the integrated circuit package, in which the magnetic shielding structure including a top plate and a bottom plate disposed on two opposite sides of the integrated circuit package.
Claims20
A method, comprising:
- providing an integrated circuit package comprising:
- a semiconductor chip;
- a pin electrically connected to the semiconductor chip;
- and
- a molding material surrounding the semiconductor chip, wherein the pin extends outside the molding material;
- forming a magnetic shielding structure comprising a top plate and a bottom plate;
- disposing the integrated circuit package between the top plate and the bottom plate, wherein after disposing integrated circuit package between the top plate and the bottom plate, the molding material of the integrated circuit package is separated from the top plate and the bottom plate by gaps, wherein a topmost surface of the bottom plate is not in contact with the integrated circuit package and is separated from the integrated circuit package by an empty space;
- after disposing the integrated circuit package between the top plate and the bottom plate, fixing a plurality of non-magnetic pillars on edges of the top plate and the bottom plate, wherein top ends of the non-magnetic pillars are in contact with the top plate and bottom ends of the non-magnetic pillars are in contact with the bottom plate;
- and
- adjusting a position of the integrated circuit package between the top plate and the bottom plate of the magnetic shielding structure based on a relative position of a magnet and the integrated circuit package.
7 more elements
A method, comprising:
- providing an integrated circuit package comprising:
- a semiconductor chip comprising a magnetic random access memory (MRAM);
- and
- a molding material surrounding the semiconductor chip;
- disposing a top plate of a magnetic shielding structure over the integrated circuit package, wherein the top plate overlaps an entirety of the molding material;
- disposing a bottom plate of the magnetic shielding structure below the integrated circuit package;
- disposing a plurality of pillars between the top plate and the bottom plate of the magnetic shielding structure, wherein the pillars are in contact with a bottom surface of the top plate and a top surface of the bottom plate, wherein a topmost surface of the bottom plate is not in contact with the integrated circuit package and is separated from the integrated circuit package by an empty space, the molding material of the integrated circuit package is movable relative to the pillars after disposing the pillars between the top plate and the bottom plate of the magnetic shielding structure;
- and
- adjusting a position of the integrated circuit package between the top plate and the bottom plate of the magnetic shielding structure based on a relative position of a magnet and the integrated circuit package.
6 more elements
A method, comprising:
- providing an integrated circuit package comprising:
- a semiconductor chip comprising a magnetic random access memory (MRAM);
- and
- a molding material surrounding the semiconductor chip;
- disposing a bottom plate of a magnetic shielding structure below the integrated circuit package, such that a topmost surface of the bottom plate of the magnetic shielding structure is not in contact with the molding material of the integrated circuit package;
- disposing a top plate of the magnetic shielding structure over the integrated circuit package, wherein after disposing integrated circuit package between the top plate and the bottom plate, the molding material of the integrated circuit package is separated from the top plate and the bottom plate by gaps, wherein the topmost surface of the bottom plate is not in contact with the integrated circuit package and is separated from the integrated circuit package by an empty space;
- disposing a plurality of pillars of the magnetic shielding structure between the top plate and the bottom plate, wherein top ends of the pillars are in contact with the top plate and bottom ends of the pillars are in contact with the bottom plate, and wherein from a top view, an area of the top plate is larger than an area of molding material;
- and
- adjusting a position of the integrated circuit package between the top plate and the bottom plate of the magnetic shielding structure based on a relative position of a magnet and the integrated circuit package.
6 more elements
Dependencies are inferred from the claim text.