Electronics module with shield structure

A module comprising:

• a substrate having an upper main surface and a lower main surface arranged in an up-down direction;
• a metal member including a plate-shaped portion provided on the upper main surface of the substrate, the plate-shaped portion having a front main surface and a back main surface arranged in a front-back direction when viewed in the up-down direction;
• a first electronic component mounted on the upper main surface of the substrate and disposed in front of the metal member;
• a second electronic component mounted on the upper main surface of the substrate and disposed behind the metal member;
• a sealing resin layer provided on the upper main surface of the substrate, covering the metal member, the first electronic component, and the second electronic component, and having an upper surface;
• and
• a shield provided on the upper surface of the sealing resin layer so as to be connected to an upper end of the plate-shaped portion, wherein
• the thickness of the plate-shaped portion is uniform, the plate-shaped portion is inclined with respect to the up-down direction such that the upper end of the plate-shaped portion is located behind a lower end of the plate-shaped portion, and the upper end of the plate-shaped portion is a plane that forms an acute angle with respect to the front main surface that forms an acute angle with respect to the front main surface of the plate-shaped portion and an obtuse angle with respect to the back main surface of the plate-shaped portion,
• or the thickness of the plate-shaped portion is uniform, the plate-shaped portion is inclined with respect to the up-down direction such that the upper end of the plate-shaped portion is located in front of the lower end of the plate-shaped portion, and the upper end of the plate-shaped portion is a plane that forms an obtuse angle with respect to the front main surface of the plate-shaped portion and an acute angle with respect to the back main surface of the plate-shaped portion.