H10W 20/4484
Superconducting materials
Official title: {Superconducting materials}
H10W20/4484 (Superconducting materials) appears on 115 US grants and 89 published applications in this corpus.
Search patents in H10W- Granted patents
- 115
- Published applications
- 89
- Assignees
- 54
- Inventors
- 266
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 6 | 0 |
| 1992 | 4 | 0 |
| 1993 | 7 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 5 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 4 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 1 | 1 |
| 2007 | 0 | 0 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 1 | 3 |
| 2015 | 1 | 4 |
| 2016 | 4 | 1 |
| 2017 | 2 | 2 |
| 2018 | 3 | 11 |
| 2019 | 9 | 9 |
| 2020 | 10 | 10 |
| 2021 | 11 | 10 |
| 2022 | 3 | 6 |
| 2023 | 7 | 9 |
| 2024 | 6 | 9 |
| 2025 | 9 | 4 |
| 2026 | 6 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Technologies for back side structures on a quantum processor die16 Jun 2026US 12,660,604 B1Intel Corporation
- Through silicon via interconnection structure and method of forming same, and quantum computing device7 Apr 2026US 12,598,967 B2Tencent Technology (Shenzhen) Company Limited
- Electrical, mechanical, computing, and/or other devices formed of extremely low resistance materials24 Mar 2026US 12,588,427 B2Ambature, Inc.
- Silicon wafer and method for filling silicon via thereof3 Mar 2026US 12,568,805 B2Tencent Technology (Shenzhen) Company Limited
- Superconducting device and method for manufacturing the same10 Feb 2026US 12,550,628 B2NEC Corporation
- Electrical, Mechanical, Computing and/or Other Devices Formed of Extremely Low Resistance Materials13 Aug 2026US 2026/0239890 A1Ambature, Inc.
- Electrical, Mechanical, Computing and/or Other Devices Formed of High Temperature Superconducting Materials13 Aug 2026US 2026/0239891 A1Ambature, Inc.
- Monohydride passivation of high resistivity si(111) for quantum information technologies6 Aug 2026US 2026/0231687 A1Northwestern University
- Methods of manufacturing superconducting via through semiconductor wafer30 Jul 2026US 2026/0223613 A1Oxford Instruments Nanotechnology Tools Limited
- Method for producing interconnections25 Jun 2026US 2026/0182355 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
Most cited
By later US patents
- High conductivity interconnection line243US 5,659,201 AAdvanced Micro Devices, Inc. · 1997
- Superconducting damascene interconnected for integrated circuit133US 6,420,189 B1Advanced Micro Devices, Inc. · 2002
- Semiconductor devices having superconducting interconnects75US 4,837,609 AAmerican Telephone and Telegraph Company, AT&T Bell Laboratories · 1989
- Epitaxial oxides on amorphous SiO.sub.2 on single crystal silicon61US 5,912,068 AThe Regents of the University of California · 1999
- Qubit and coupler circuit structures and coupling techniques60US 10,134,972 B2Massachusetts Institute of Technology · 2018