Superconducting device and method for manufacturing the same

A method for manufacturing a superconducting device including a superconducting integrated circuit chip having a first electrode made of a first superconducting material and a first non-contact coupling circuit on a surface thereof, and a circuit board having a second electrode made of a second superconducting material and a second non-contact coupling circuit on a surface thereof, the circuit board being arranged in such a way to face the superconducting integrated circuit chip, the second electrode having a protrusion having a flat upper surface and protruding toward the superconducting integrated circuit chip, the first electrode including a flat surface and a first recess arranged inside the flat surface and having an area smaller than an area of the upper surface, the method comprising:

• arranging a third superconducting material connecting the upper surface and the first recess inside the first recess;
• arranging the first recess in such a way that the first recess faces the upper surface to be located inside the upper surface;
• and
• bringing the upper surface and the flat surface into contact with each other.