H10W 20/427
Power or ground buses
Official title: {Power or ground buses}
H10W20/427 (Power or ground buses) appears on 3,193 US grants and 4,834 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,193
- Published applications
- 4,834
- Assignees
- 468
- Inventors
- 5,530
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 4 | 0 |
| 1986 | 4 | 0 |
| 1987 | 5 | 0 |
| 1988 | 4 | 0 |
| 1989 | 2 | 0 |
| 1990 | 11 | 0 |
| 1991 | 11 | 0 |
| 1992 | 16 | 0 |
| 1993 | 5 | 0 |
| 1994 | 11 | 0 |
| 1995 | 10 | 0 |
| 1996 | 9 | 0 |
| 1997 | 11 | 0 |
| 1998 | 14 | 0 |
| 1999 | 12 | 0 |
| 2000 | 8 | 0 |
| 2001 | 18 | 11 |
| 2002 | 40 | 37 |
| 2003 | 42 | 50 |
| 2004 | 50 | 63 |
| 2005 | 46 | 72 |
| 2006 | 38 | 74 |
| 2007 | 44 | 96 |
| 2008 | 76 | 104 |
| 2009 | 39 | 69 |
| 2010 | 45 | 46 |
| 2011 | 69 | 38 |
| 2012 | 50 | 71 |
| 2013 | 75 | 55 |
| 2014 | 73 | 76 |
| 2015 | 78 | 94 |
| 2016 | 90 | 86 |
| 2017 | 104 | 137 |
| 2018 | 127 | 158 |
| 2019 | 152 | 155 |
| 2020 | 158 | 181 |
| 2021 | 148 | 301 |
| 2022 | 215 | 410 |
| 2023 | 266 | 493 |
| 2024 | 321 | 734 |
| 2025 | 382 | 771 |
| 2026 | 305 | 452 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- 3D-stacked semiconductor device including middle isolation structure and BSPDN structure6 Oct 2026US 12,757,485 B2Samsung Electronics Co., Ltd.
- Method and structure for forming landing for backside power distribution network6 Oct 2026US 12,757,715 B2International Business Machines Corporation
- FINFET Devices with Backside Power Rail and Backside Self-Aligned Via8 Oct 2026US 2026/0313945 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit device8 Oct 2026US 2026/0313964 A1Samsung Electronics Co., Ltd.
- Semiconductor device structure and methods of forming the same8 Oct 2026US 2026/0314053 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device structure and manufacturing method thereof8 Oct 2026US 2026/0314277 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit device and method8 Oct 2026US 2026/0314376 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Semiconductor integrated circuit device, semiconductor integrated circuit wiring method, and cell arranging method364US 6,262,487 B1Kabushiki Kaisha Toshiba · 2001
- Multilayer wiring structure283US 5,723,908 AKabushiki Kaisha Toshiba · 1998
- Integrated circuit design incorporating a power mesh236US 6,480,989 B2LSI Logic Corporation · 2002
- Top layers of metal for high performance IC's207US 6,383,916 B12002
- Three-dimensional stacked LSI193US 5,191,405 AMatsushita Electric Industrial Co., Ltd. · 1993