H10P 72/0462
Characterised by the construction of the processing chambers
Official title: {characterised by the construction of the processing chambers, e.g. modular processing chambers}
H10P72/0462 (Characterised by the construction of the processing chambers) appears on 1,893 US grants and 2,730 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,893
- Published applications
- 2,730
- Assignees
- 434
- Inventors
- 4,938
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 7 | 0 |
| 1990 | 2 | 0 |
| 1991 | 10 | 0 |
| 1992 | 5 | 0 |
| 1993 | 4 | 0 |
| 1994 | 5 | 0 |
| 1995 | 4 | 0 |
| 1996 | 6 | 0 |
| 1997 | 6 | 0 |
| 1998 | 8 | 0 |
| 1999 | 9 | 0 |
| 2000 | 17 | 0 |
| 2001 | 26 | 14 |
| 2002 | 22 | 36 |
| 2003 | 26 | 25 |
| 2004 | 19 | 46 |
| 2005 | 25 | 56 |
| 2006 | 17 | 55 |
| 2007 | 25 | 55 |
| 2008 | 24 | 92 |
| 2009 | 15 | 67 |
| 2010 | 34 | 69 |
| 2011 | 39 | 75 |
| 2012 | 49 | 103 |
| 2013 | 64 | 88 |
| 2014 | 84 | 91 |
| 2015 | 71 | 86 |
| 2016 | 62 | 91 |
| 2017 | 54 | 134 |
| 2018 | 87 | 155 |
| 2019 | 115 | 189 |
| 2020 | 146 | 170 |
| 2021 | 129 | 160 |
| 2022 | 118 | 208 |
| 2023 | 129 | 227 |
| 2024 | 159 | 167 |
| 2025 | 157 | 158 |
| 2026 | 105 | 113 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Information processing system, power adjustment method, and heat treatment apparatus22 Sep 2026US 12,745,589 B2Tokyo Electron Limited
- Seal structure, substrate processing apparatus, substrate processing method and method of manufacturing semiconductor device15 Sep 2026US 12,738,461 B2Kokusai Electric Corporation
- Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium15 Sep 2026US 12,740,361 B2Kokusai Electric Corporation
- Substrate processing equipment and method of driving substrate processing equipment8 Sep 2026US 12,731,965 B2Semes Co., Ltd.
- Substrate processing apparatus1 Sep 2026US 12,727,423 B2SCREEN Holdings Co., Ltd.
- Substrate processing apparatus and substrate processing method24 Sep 2026US 2026/0293584 A1SCREEN Holdings Co., Ltd.
- Substrate processing apparatus24 Sep 2026US 2026/0293596 A1SCREEN Holdings Co., Ltd.
- Automated machine learning with spatial sensor10 Sep 2026US 2026/0271657 A1Lam Research Corporation
- Multl-station tool with rotatable top plate assembly10 Sep 2026US 2026/0271672 A1Lam Research Corporation
- Cmp device and wafer transfer method3 Sep 2026US 2026/0262468 A1Hangzhou Sizone Electronic Technology Inc.
Most cited
By later US patents
- Ultra high throughput wafer vacuum processing system973US 5,855,681 AAPPLIED Materials.Inc. · 1999
- Compartnetalized substrate processing chamber732US 5,730,801 AAPPLIED Materials.Inc. · 1998
- Wafer processing cluster tool batch preheating and degassing apparatus663US 5,259,881 AMaterials Research Corporation · 1993
- Modular processing apparatus for processing semiconductor wafers635US 4,722,298 AMachine Technology, Inc. · 1988
- Rapid thermal processing apparatus for processing semiconductor wafers624US 5,444,217 AMoore Epitaxial, Inc. · 1995