Automated machine learning with spatial sensor

A method comprising:

• transferring a wafer into a process tool, wherein the process tool comprises:
• a vacuum transfer module;
• a process module having a first sidewall in common with the vacuum transfer module, wherein a pedestal comprising a wafer chuck is within the process module, and wherein at least one viewport window is within a second sidewall of the process module;
• a spatial sensor located outside of the process module, wherein the spatial sensor is adjacent to the at least one viewport window and the wafer chuck is within a field of view of the spatial sensor;
• and
• a computing device electronically coupled to the spatial sensor;
• placing a teach fixture onto the wafer chuck;
• moving an end effector to the pedestal;
• aligning the end effector to the teach fixture;
• and
• positioning the end effector by monitoring one or more coordinates of the end effector by the spatial sensor for performing a wafer handoff.

A method comprising:

• transferring a wafer into a process tool, wherein the process tool comprises:
• a vacuum transfer module;
• a process module having a first sidewall in common with the vacuum transfer module, wherein a pedestal comprising a wafer chuck is within the process module, and wherein at least one viewport window is within a second sidewall of the process module;
• at least one spatial sensor located outside of the process module, wherein a spatial sensor is adjacent to the at least one viewport window and the wafer chuck is within a field of view of the spatial sensor;
• and
• a computing device electronically coupled to the spatial sensor;
• placing the wafer onto the wafer chuck;
• wherein a position of the wafer on the wafer chuck is monitored by the spatial sensor;
• measuring an acentric offset of the wafer with respect to a reference contour;
• storing in a memory one or more coordinates of the acentric offset;
• and
• correcting the acentric offset by centering the wafer on the wafer chuck.

A method for monitoring particle growth on a wafer under process, the method comprising:

• performing a deposition process within a process tool which comprises:
• a process module comprising a pedestal and a viewport window within a wall of the process module;
• and
• a spatial sensor coupled to the process module and adjacent to the viewport window, wherein the wafer is on the pedestal, wherein the wafer is within a field of view of the spatial sensor, wherein the method further comprises:
• collecting a video data stream from the spatial sensor;
• measuring a surface roughness of a film growing on the wafer;
• and
• comparing the surface roughness of the film to a threshold value.