H10P 72/0446
Apparatus for mounting on conductive members
Official title: {Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates}
H10P72/0446 (Apparatus for mounting on conductive members) appears on 1,380 US grants and 1,426 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,380
- Published applications
- 1,426
- Assignees
- 522
- Inventors
- 2,883
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 18 | 0 |
| 1977 | 5 | 0 |
| 1978 | 9 | 0 |
| 1979 | 0 | 0 |
| 1980 | 6 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 3 | 0 |
| 1985 | 12 | 0 |
| 1986 | 9 | 0 |
| 1987 | 8 | 0 |
| 1988 | 8 | 0 |
| 1989 | 22 | 0 |
| 1990 | 18 | 0 |
| 1991 | 14 | 0 |
| 1992 | 22 | 0 |
| 1993 | 15 | 0 |
| 1994 | 13 | 0 |
| 1995 | 7 | 0 |
| 1996 | 10 | 0 |
| 1997 | 13 | 0 |
| 1998 | 19 | 0 |
| 1999 | 17 | 0 |
| 2000 | 18 | 0 |
| 2001 | 41 | 22 |
| 2002 | 29 | 43 |
| 2003 | 41 | 41 |
| 2004 | 40 | 47 |
| 2005 | 21 | 48 |
| 2006 | 31 | 30 |
| 2007 | 31 | 36 |
| 2008 | 13 | 31 |
| 2009 | 22 | 31 |
| 2010 | 36 | 35 |
| 2011 | 14 | 17 |
| 2012 | 24 | 16 |
| 2013 | 19 | 29 |
| 2014 | 21 | 25 |
| 2015 | 15 | 30 |
| 2016 | 25 | 22 |
| 2017 | 31 | 66 |
| 2018 | 42 | 73 |
| 2019 | 85 | 111 |
| 2020 | 107 | 118 |
| 2021 | 88 | 103 |
| 2022 | 70 | 116 |
| 2023 | 66 | 87 |
| 2024 | 77 | 95 |
| 2025 | 79 | 97 |
| 2026 | 41 | 57 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Bonding apparatus, bonding system, and bonding method8 Oct 2026US 2026/0314302 A1Tokyo Electron Limited
- Pick-and-place tool and method of manufacturing semiconductor structure8 Oct 2026US 2026/0314303 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Mass transfer apparatus and mass transfer method thereof8 Oct 2026US 2026/0314318 A1Century Technology (Shenzhen) Corporation Limited
- Method of separating a chip from a carrier and a system for performing the method1 Oct 2026US 2026/0305260 A1
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Most cited
By later US patents
- Method of transferring a micro device250US 8,333,860 B1LuxVue Technology Corporation · 2012
- Metal foil semiconductor interconnection method241US 4,756,080 AAmerican Microsystems, Inc. · 1988
- Die processing235US 10,269,756 B2Invensas Bonding Technologies, Inc. · 2019
- Micro device transfer head heater assembly and method of transferring a micro device220US 8,349,116 B1LuxVue Technology Corporation · 2013
- Apparatus and method for mounting a chip211US 5,839,187 AMatsushita Electric Industrial Co., Ltd. · 1998