Micro device transfer head heater assembly and method of transferring a micro device
AssigneeLuxVue Technology Corporation
InventorsAndreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
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Abstract
A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
Claims30
A method of transferring a micro device comprising:
- heating a carrier substrate carrying a micro device connected to a bonding layer to a temperature below a liquidus temperature of the bonding layer;
- heating a transfer head to a temperature above the liquidus temperature of the bonding layer;
- contacting the micro device with a transfer head, wherein heat transfers from the transfer head into the bonding layer to at least partially melt the bonding layer;
- applying a voltage to the transfer head to create a grip pressure on the micro device;
- and
- picking up the micro device with the transfer head;
- placing the micro device in contact with a receiving substrate;
- and
- releasing the micro device onto the receiving substrate.
A method of transferring an array of micro devices comprising:
- heating a carrier substrate carrying an array of micro devices connected to a plurality of locations of a bonding layer to a temperature below a liquidus temperature of the bonding layer;
- heating an array of transfer heads to a temperature above the liquidus temperature of the bonding layer;
- contacting the array of micro devices with the array of transfer heads, wherein heat transfers from the array of transfer heads into the plurality of locations of the bonding layer to at least partially melt portions of the plurality of locations of the bonding layer;
- selectively applying a voltage to a portion of the array of transfer heads;
- picking up a corresponding portion of the array of micro devices with the portion of the array of transfer heads;
- contacting a receiving substrate with the portion of the array of micro devices;
- and
- selectively releasing the portion of the array of micro devices onto at least one receiving substrate.
A method of transferring an array of micro devices comprising:
- heating a carrier substrate carrying an array of micro devices connected to a plurality of locations of a bonding layer to a temperature below a liquidus temperature of the bonding layer;
- heating an array of transfer heads to a temperature above the liquidus temperature of the bonding layer;
- contacting the array of micro devices with the array of transfer heads, wherein heat transfers from the array of transfer heads into the plurality of locations of the bonding layer to at least partially melt portions of the plurality of locations of the bonding layer;
- applying a voltage to the array of transfer heads;
- picking up the array of micro devices with the array of transfer heads;
- contacting a receiving substrate with the array of micro devices;
- and
- releasing array of micro devices onto the receiving substrate.
Dependencies are inferred from the claim text.