Semiconductor manufacturing apparatus

Abstract

A semiconductor manufacturing apparatus according to the present embodiment includes a push-up device, a transfer device, an electronic component holding device, and a mounting device. The push-up device is capable of pushing up a plurality of adjacent electronic components among a plurality of electronic components diced from a wafer. The transfer device is capable of transferring the plurality of electronic components pushed up by the push-up device. The electronic component holding device is capable of holding the plurality of electronic components transferred by the transfer device. At least part of the push-up device is capable of pushing up the plurality of adjacent electronic components by spanning the adjacent electronic components on the same surface. The electronic component holding device is capable of switching, for each of the electronic components, a holding state of the electronic component and a non-holding state of the electronic component.

Dependencies are inferred from the claim text.