Method of separating a chip from a carrier and a system for performing the method
OwnerNilabh K. Royinventor
Life of this patent
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Abstract
A method of separating a chip from a carrier includes holding the carrier with a chuck such that a first region of the chuck overlaps a central portion of the chip and a second region of the chuck overlaps an outer portion of the chip, applying a first vacuum pressure to the first region and applying a second vacuum pressure to the second region such that a portion of the carrier adhered to the outer portion of the chip separates from the chip while a portion of the carrier adhered to the central portion of the chip remains adhered to the chip, and separating the portion of the carrier adhered to the central portion of the chip from the chip by applying a force to the chip in a direction away from the chuck.
Claims20
A method of separating a chip from a carrier, comprising:
- holding the carrier with a chuck such that a first region of the chuck overlaps a central portion of the chip and a second region of the chuck overlaps an outer portion of the chip,
- applying a first vacuum pressure to the first region and applying a second vacuum pressure to the second region such that a portion of the carrier adhered to the outer portion of the chip separates from the chip while a portion of the carrier adhered to the central portion of the chip remains adhered to the chip;
- and
- separating the portion of the carrier adhered to the central portion of the chip from the chip by applying a force to the chip in a direction away from the chuck.
A system for separating a chip from a carrier, comprising:
- a chuck having a first region and a second region;
- a vacuum supply;
- a die pickup member;
- one or more processors;
- and
- one or more memories storing instructions, when executed by the one or more processors, causing the system to:
- actuate the vacuum supply to hold the carrier with the chuck such that the first region of the chuck overlaps a central portion of the die and the second region of the chuck overlaps an outer portion of the die,
- actuate the vacuum supply to apply a first vacuum pressure to the first region and to apply a second vacuum pressure to the second region such that a portion of the carrier adhered to the outer portion of the die separates from the die while a portion of the carrier adhered to the central portion of the die remains adhered to the die;
- and
- actuate the die pickup member to separate the portion of the carrier adhered to the central portion of the die from the die by applying a force to the die in a direction away from the chuck.
A method of manufacturing an article, comprising:
- holding a carrier with a chuck such that a first region of the chuck overlaps a central portion of a die and a second region of the chuck overlaps an outer portion of the die,
- applying a first vacuum pressure to the first region and applying a second vacuum pressure to the second region such that a portion of the carrier adhered to the outer portion of the die separates from the die while a portion of the carrier adhered to the central portion of the die remains adhered to the die;
- separating the portion of the carrier adhered to the central portion of the die from the die by applying a force to the die in a direction away from the chuck;
- actuating a bonding head to cause the separated die to bond to a bonding surface of a substrate;
- and
- singulating the substrate to produce the article.
Dependencies are inferred from the claim text.