Pickup system, bonding device, sorting device, and pickup method

A pickup system comprising:

• an upward pusher that pushes a component adhering to an adhesive sheet upward via the adhesive sheet;
• a component holder that includes a holding tool, and holds the component in a non-contact manner using the holding tool, the holding tool including an opening and being configured to be raised and lowered;
• a negative pressure generator that generates a negative pressure around the opening of the holding tool;
• an ultrasonic generator that generates an ultrasonic wave by vibrating the holding tool;
• and
• a controller that controls the upward pusher, the component holder, the negative pressure generator, and the ultrasonic generator,
• wherein the controller:
• causes the upward pusher to push the component upward after causing the ultrasonic generator to generate the ultrasonic wave;
• and
• causes the negative pressure generator to generate the negative pressure in a state where the ultrasonic wave is being generated to cause the component holder to hold the component in the non-contact manner.