H10P 54/92
For protecting or reinforcing the surface of wafers or substrates during cutting
Official title: for protecting or reinforcing the surface of wafers or substrates during cutting or separating, e.g. using adhesive tapes
H10P54/92 (For protecting or reinforcing the surface of wafers or substrates during cutting) appears on 7 US grants and 21 published applications in this corpus.
Search patents in H10P- Granted patents
- 7
- Published applications
- 21
- Assignees
- 18
- Inventors
- 72
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 2 |
| 2019 | 1 | 0 |
| 2020 | 1 | 1 |
| 2021 | 1 | 0 |
| 2022 | 0 | 1 |
| 2023 | 0 | 1 |
| 2024 | 0 | 3 |
| 2025 | 0 | 4 |
| 2026 | 3 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Photonic integrated circuit chip facet preparation via laser-based dicing29 Sep 2026US 12,751,230 B2IonQ, Inc.
- Edge structure of semiconductor wafer and manufacturing method thereof29 Sep 2026US 12,751,231 B2United Microelectronics Corp.
- Method of processing SiC wafer18 Aug 2026US 12,713,861 B2Disco Corporation
- Semiconductor device8 Jun 2021US 11,031,357 B2Mitsubishi Electric Corporation
- Semiconductor device25 Aug 2020US 10,756,029 B2Mitsubishi Electric Corporation
- Stock roll for protective film transfer, protective film arranging method, and chip manufacturing method1 Oct 2026US 2026/0305212 A1Disco Corporation
- Method for cleaning semiconductor chip, and method for manufacturing semiconductor device1 Oct 2026US 2026/0305220 A1
- Method for manufacturing semiconductor device24 Sep 2026US 2026/0293564 A1Kabushiki Kaisha Toshiba
- Adhesive composition, adhesive tape, method for processing semiconductor wafer, and method for producing semiconductor device13 Aug 2026US 2026/0234449 A1Sekisui Chemical Co., Ltd.
- Method for processing workpiece and method for manufacturing semiconductor device13 Aug 2026US 2026/0239908 A1Disco Corporation
Most cited
By later US patents