H10P 54/924
Using expanding wafer tapes
Official title: {using expanding wafer tapes}
H10P54/924 (Using expanding wafer tapes) appears on 1 US grants and 4 published applications in this corpus.
Search patents in H10P- Granted patents
- 1
- Published applications
- 4
- Assignees
- 4
- Inventors
- 15
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2025 | 0 | 3 |
| 2026 | 1 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Dicing/die-bonding integrated film and method for manufacturing the same2 Jul 2026US 2026/0190945 A1Resonac Corporation
- Methods for singulating semiconductor die from silicon carbide substrates18 Sep 2025US 2025/0293092 A1Semiconductor Components Industries, LLC
- Wafer-level chip scale package semiconductor devices with light blocking material and methods3 Jul 2025US 2025/0218975 A1Texas Instruments Incorporated
- Photonic integrated circuit chip facet preparation via laser-based dicing20 Mar 2025US 2025/0091163 A1IonQ, Inc.
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.