Adhesive composition, adhesive tape, method for processing semiconductor wafer, and method for producing semiconductor device

Abstract

The present invention aims to provide an adhesive composition that can achieve both excellent filling properties for irregularities and excellent removability. The present invention also aims to provide an adhesive tape including an adhesive layer containing the adhesive composition. The present invention also aims to provide a method for processing a semiconductor wafer using the adhesive tape and a method for producing a semiconductor device using the adhesive tape. Provided is an adhesive composition containing a (meth)acrylic copolymer, the (meth)acrylic copolymer containing a structural unit derived from n-heptyl (meth)acrylate, the (meth)acrylic copolymer having a carbon-carbon double bond in a side chain.

Dependencies are inferred from the claim text.