H10P 54/922
Arrangements for stress mitigation
Official title: {Arrangements for stress mitigation, e.g. crack stops}
H10P54/922 (Arrangements for stress mitigation) appears on 3 US grants and 9 published applications in this corpus.
Search patents in H10P- Granted patents
- 3
- Published applications
- 9
- Assignees
- 8
- Inventors
- 27
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2018 | 0 | 1 |
| 2019 | 0 | 0 |
| 2020 | 1 | 1 |
| 2021 | 1 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 1 |
| 2024 | 0 | 1 |
| 2025 | 0 | 1 |
| 2026 | 1 | 4 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing semiconductor device24 Sep 2026US 2026/0293564 A1Kabushiki Kaisha Toshiba
- Semiconductor device13 Aug 2026US 2026/0239992 A1SK hynix Inc.
- Wire electrical discharge machining apparatus, wire electrical discharge machining method, and wafer manufacturing method16 Jul 2026US 2026/0199995 A1Mitsubishi Electric Corporation
- Sidewall padding for a semiconductor die for stress absorption and methods of forming the same16 Apr 2026US 2026/0107827 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Edge structure of semiconductor wafer and manufacturing method thereof22 May 2025US 2025/0166997 A1United Microelectronics Corp.
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.