Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsTetsuo Takahashi, Masayoshi Tarutani, Kazuhiko Sakutani, Kenji Harada, Masao Takata, Kouichi In
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AssigneeMitsubishi Electric Corporation
InventorsTetsuo Takahashi, Masayoshi Tarutani, Kazuhiko Sakutani, Kenji Harada, Masao Takata, Kouichi In
Estimating the term…
There is provided a semiconductor device having a structure that can suppress occurrence of chipping in a device region and that can reduce manufacturing cost of the semiconductor device. A semiconductor device includes a substrate and a first amorphous insulating film. The substrate has a main surface and an end surface. The main surface includes a peripheral region and a device region. The first amorphous insulating film is disposed on the peripheral region, and is separated from the device region. The first amorphous insulating film extends along the end surface in the form of a stripe. The first amorphous insulating film is flush with the end surface.
A semiconductor device comprising:
A semiconductor device comprising:
A semiconductor device comprising a substrate having a main surface, and an end surface defining an outer edge of the substrate and extending in a direction transverse to the main surface, and the substrate being provided with a notch portion connected to the main surface and the end surface, the main surface including a peripheral region and a device region surrounded by the peripheral region, the notch portion extending in a form of a stripe along the direction in which the end surface extends,
A semiconductor device comprising:
Dependencies are inferred from the claim text.