Method for processing workpiece and method for manufacturing semiconductor device
AssigneeDisco Corporation
InventorsYosuke Aoyagi, Kenji Takenouchi
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Abstract
A method for processing a workpiece is provided which can carry out proper hybrid bonding without causing an oxidation/etching phenomenon at a metal portion of a device even when the method includes cutting by a cutting blade. The method includes forming a protective film at the metal portion exposed at a surface of the workpiece, cutting by a cutting blade while supplying cutting water to the workpiece, and removing the protective film. At the forming the protective film, a protective film forming solution containing an anticorrosive is supplied, thereby forming a protective film on the metal portion.
Claims5
A method for processing a workpiece, comprising:
- forming a protective film on a metal portion exposed at a surface of the workpiece;
- cutting by a cutting blade while supplying cutting water to the workpiece;
- and
- removing the protective film,
- wherein at the forming the protective film,
- the protective film is formed on the metal portion by supplying a protective film forming solution containing an anticorrosive.
A method for manufacturing a semiconductor device, in which a substrate including devices respectively formed in regions partitioned by a plurality of crossing division lines is divided to form device chips, and then, device surfaces are bonded with each other, the method comprising:
- forming a protective film on a metal portion exposed on the device of a substrate;
- cutting the substrate by a cutting blade while supplying cutting water along the division lines of the substrate;
- grinding and thinning a surface of the substrate opposite to a surface on which the device is formed by a grinding wheel;
- removing the protective film;
- and
- bonding the device surfaces of the device chips, wherein
- the forming the protective film is performed by suppling a protective film forming solution containing an anticorrosive, and thereby forms a protective film on the metal portion of the device.
Dependencies are inferred from the claim text.