H10P 30/208
Of electrically inactive species
Official title: {of electrically inactive species}
H10P30/208 (Of electrically inactive species) appears on 3,281 US grants and 3,226 published applications in this corpus.
Search patents in H10P- Granted patents
- 3,281
- Published applications
- 3,226
- Assignees
- 574
- Inventors
- 4,944
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 7 | 0 |
| 1978 | 9 | 0 |
| 1979 | 10 | 0 |
| 1980 | 3 | 0 |
| 1981 | 4 | 0 |
| 1982 | 4 | 0 |
| 1983 | 9 | 0 |
| 1984 | 8 | 0 |
| 1985 | 20 | 0 |
| 1986 | 10 | 0 |
| 1987 | 18 | 0 |
| 1988 | 9 | 0 |
| 1989 | 14 | 0 |
| 1990 | 8 | 0 |
| 1991 | 4 | 0 |
| 1992 | 11 | 0 |
| 1993 | 20 | 0 |
| 1994 | 20 | 0 |
| 1995 | 17 | 0 |
| 1996 | 14 | 0 |
| 1997 | 20 | 0 |
| 1998 | 26 | 0 |
| 1999 | 65 | 0 |
| 2000 | 98 | 0 |
| 2001 | 91 | 21 |
| 2002 | 97 | 65 |
| 2003 | 77 | 58 |
| 2004 | 84 | 112 |
| 2005 | 48 | 110 |
| 2006 | 86 | 150 |
| 2007 | 90 | 132 |
| 2008 | 83 | 176 |
| 2009 | 96 | 164 |
| 2010 | 130 | 130 |
| 2011 | 119 | 112 |
| 2012 | 93 | 134 |
| 2013 | 126 | 146 |
| 2014 | 156 | 145 |
| 2015 | 153 | 214 |
| 2016 | 196 | 197 |
| 2017 | 181 | 200 |
| 2018 | 170 | 149 |
| 2019 | 159 | 128 |
| 2020 | 130 | 120 |
| 2021 | 106 | 121 |
| 2022 | 81 | 129 |
| 2023 | 96 | 104 |
| 2024 | 91 | 92 |
| 2025 | 73 | 75 |
| 2026 | 34 | 42 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Structure with capacitor and fin transistor and fabricating method of the same6 Oct 2026US 12,757,480 B2United Microelectronics Corp.
- Complementary transistor and semiconductor device8 Sep 2026US 12,733,254 B2Sony Group Corporation
- Chip including silicon device and III-V semiconductor device on III-V semiconductor layer8 Sep 2026US 12,733,262 B2GLOBALFOUNDRIES U. S. Inc.
- Semiconductor device and related chip and preparation method25 Aug 2026US 12,720,781 B2Huawei Technologies Co., Ltd.
- Method for producing a microelectronic device25 Aug 2026US 12,721,068 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Deep trench isolation for semiconductor devices with enhanced breakdown protection8 Oct 2026US 2026/0314421 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Field effect transistor for reducing hot carrier damage and methods for forming the same17 Sep 2026US 2026/0282425 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and method for manufacturing semiconductor device17 Sep 2026US 2026/0282426 A1Denso Corporation
- Forming notches on wafer sidewall for wafer cut17 Sep 2026US 2026/0282852 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Iii-v compound semiconductor layer stacks on strain-relieved semiconductor substrates20 Aug 2026US 2026/0247648 A1GLOBALFOUNDRIES U. S. Inc.
Most cited
By later US patents
- Process for the production of thin semiconductor material films1,233US 5,374,564 ACommissariat A L' Energie Atomique · 1994
- High performance gaas devices and method497US 5,436,499 ASpire Corporation · 1995
- Source/drain performance through conformal solid state doping469US 10,032,628 B2ASM IP Holding B. V. · 2018
- Controlled cleavage process and device for patterned films426US 5,985,742 ASilicon Genesis Corporation · 1999
- Method of obtaining a thin film of semiconductor material345US 6,103,597 ACommissariat A L' Energie Atomique · 2000