H10P 14/6542
By using coherent radiation
Official title: {by using coherent radiation, e.g. using a laser}
H10P14/6542 (By using coherent radiation) appears on 103 US grants and 115 published applications in this corpus.
Search patents in H10P- Granted patents
- 103
- Published applications
- 115
- Assignees
- 65
- Inventors
- 301
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 1 |
| 2002 | 1 | 2 |
| 2003 | 2 | 7 |
| 2004 | 6 | 5 |
| 2005 | 4 | 10 |
| 2006 | 6 | 5 |
| 2007 | 7 | 6 |
| 2008 | 2 | 6 |
| 2009 | 6 | 4 |
| 2010 | 3 | 2 |
| 2011 | 2 | 2 |
| 2012 | 3 | 2 |
| 2013 | 0 | 0 |
| 2014 | 2 | 3 |
| 2015 | 1 | 3 |
| 2016 | 3 | 5 |
| 2017 | 4 | 2 |
| 2018 | 6 | 7 |
| 2019 | 4 | 4 |
| 2020 | 6 | 8 |
| 2021 | 6 | 8 |
| 2022 | 3 | 4 |
| 2023 | 3 | 4 |
| 2024 | 1 | 7 |
| 2025 | 8 | 4 |
| 2026 | 4 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Manufacturing method for semiconductor device25 Aug 2026US 12,721,064 B2Tokyo Electron Limited
- Semiconductor device and method of manufacturing the same28 Jul 2026US 12,696,697 B2Denso Corporation
- Process of making components for electronic and optical devices using laser processing including ablation21 Apr 2026US 12,606,896 B2The United States of America as represented by the Secretary of the Air Force
- Semiconductor processing equipment part and method for making the same14 Apr 2026US 12,604,683 B2Dah Young Vacuum Equipment Co., Ltd.
- Scalable method for security barriers23 Dec 2025US 12,506,092 B2Raytheon Company
- Optical device with optical coating edge integrity9 Jul 2026US 2026/0194694 A1Viavi Solutions Inc.
- Methods for wafer level processing of optical devices with optical coating edge integrity9 Jul 2026US 2026/0198243 A1Viavi Solutions Inc.
- Planarization process with laser treatment7 May 2026US 2026/0130140 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device package thermal conduit16 Apr 2026US 2026/0107709 A1Texas Instruments Incorporated
- Semiconductor device and method of manufacturing the same30 Oct 2025US 2025/0338569 A1Renesas Electronics Corporation
Most cited
By later US patents
- Sequential deposition/anneal film densification method626US 7,790,633 B1Novellus Systems, Inc. · 2010
- Methods for forming metal oxide layers with enhanced purity606US 6,395,650 B1International Business Machines Corporation · 2002
- Method for manufacturing semiconductor device391US 8,324,699 B2Semiconductor Energy Laboratory Co.Ltd. · 2012
- Method of fabricating poly-crystalline silicon thin film and method of fabricating transistor using the same259US 7,563,659 B2Samsung Electronics Co., Ltd. · 2009
- Semiconductor device and method for forming the same103US 6,168,980 ASemiconductor Energy Laboratory Co.Ltd. · 2001