Back to results
US 2026/0130140 A1Published application
Planarization process with laser treatment
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJhih Guang Wu, Chih Hung Chen, Jin-Hao Jhang
Life of this patent
Estimating the term…
Abstract
A method includes forming a first layer over a second layer; performing a laser treatment process on the first layer, wherein the laser treatment process includes directing a laser beam into the first layer, wherein the laser beam modifies the first layer; and after performing the laser treatment process on the first layer, performing a planarization process on the first layer to remove the first layer, wherein the planarization process exposes the second layer.
Claims20
A method comprising:
- forming a first layer over a second layer;
- performing a laser treatment process on the first layer, wherein the laser treatment process comprises directing a laser beam into the first layer, wherein the laser beam modifies the first layer;
- and
- after performing the laser treatment process on the first layer, performing a planarization process on the first layer to remove the first layer, wherein the planarization process exposes the second layer.
1 more element
A method comprising:
- depositing a first layer over a substrate, wherein the first layer is a first material;
- and
- removing an upper portion of the first layer, comprising:
- scanning a laser beam across a top surface of the first layer, wherein after scanning the laser beam, the upper portion of the first layer has different physical properties than an underlying lower region of the first layer;
- and
- polishing the upper portion of the first layer to expose the lower region of the first layer.
3 more elements
A method comprising:
- forming a first bonding layer over a first substrate;
- forming a second bonding layer over a second substrate;
- bonding the first bonding layer to the second bonding layer using a fusion bonding process;
- heating the first substrate using a first laser;
- and
- removing the first substrate using a first mechanical planarization process.
3 more elements
Dependencies are inferred from the claim text.